Conductive paste and glass article

Patent metadata

Field	Value
Publication number	US-10052690-B2
Application number	US-201615364843-A
Country	US
Kind code	B2
Filing date	Nov 30, 2016
Priority date	Jun 30, 2014
Publication date	Aug 21, 2018
Grant date	Aug 21, 2018

Abstract

A conductive paste contains at least a conductive powder, glass frit, and an organic vehicle. The conductive powder contains a noble metal powder such as an Ag powder and a base metal powder containing Cu and/or Ni, and the base metal powder has a specific surface area of less than 0.5 m 2 /g. The content of the base metal powder with respect to the total amount of the conductive powder is, in ratio by weight, 0.1 to 0.3 when the base metal powder contains Cu as its main constituent, 0.1 to 0.2 when the base metal powder contains Ni as its main constituent, and 0.1 to 0.25 when the base metal powder contains a mixed powder of Cu and Ni as its main constituent.

First claim

The invention claimed is:

1. A conductive paste comprising:
a conductive powder;
glass frit; and
an organic vehicle,
wherein
the conductive powder contains a noble metal powder and a base metal powder containing at least one of Cu and Ni as a main constituent thereof,
the base metal powder has a specific surface area of less than 0.5 m 2 /g, and
a content of the base metal powder with respect to a total amount of the conductive powder is, in ratio by weight:
0.1 to 0.3 when the base metal powder contains the Cu as the main constituent thereof;
0.1 to 0.2 when the base metal powder contains the Ni as the main constituent thereof; and
0.1 to 0.25 when the base metal powder contains a mixture of the Cu and the Ni as the main constituent thereof.

2. The conductive paste according to claim 1 , wherein specific surface area of the base metal powder is 0.15 to 0.5 m 2 /g.

3. The conductive paste according to claim 1 , wherein the base metal powder is an atomized powder.

4. The conductive paste according to claim 1 , wherein the base metal powder is 8 μm or less in average particle size.

5. The conductive paste according to claim 1 , wherein the base metal powder is 2.5 to 8.0 μm in average particle size.

6. The conductive paste according to claim 1 , wherein the noble metal powder is 0.1 to 3 μm in average particle size.

7. The conductive paste according to claim 1 , wherein a content of the conductive powder is 50 to 90 wt % of the conductive paste.

8. The conductive paste according to claim 1 , wherein an average particle size of the glass frit is 2 times or less of an average particle size of the noble metal powder.

9. The conductive paste according to claim 1 , wherein the glass frit has a softening point of 350° C. to 600° C.

10. The conductive paste according to claim 1 , wherein the noble metal powder contains Ag as a main constituent thereof.

11. A glass article comprising:
a glass substrate; and
a conductive film in a predetermined pattern on the glass substrate, wherein
the conductive film is formed from the conductive paste according to claim 1 .

12. The glass article according to claim 11 , further comprising a ceramic layer interposed between the glass substrate and the conductive film.

13. The glass article according to claim 11 , wherein specific surface area of the base metal powder in the conductive paste is 0.15 to 0.5 m 2 /g.

14. The glass article according to claim 11 , wherein the base metal powder in the conductive paste is an atomized powder.

15. The glass article according to claim 11 , wherein the base metal powder in the conductive paste is 2.5 to 8.0 μm in average particle size.

16. The glass article according to claim 11 , wherein the noble metal powder in the conductive paste is 0.1 to 3 μm in average particle size.

17. The glass article according to claim 11 , wherein a content of the conductive powder in the conductive paste is 50 to 90 wt % of the conductive paste.

18. The glass article according to claim 11 , wherein an average particle size of the glass frit in the conductive paste is 2 times or less of an average particle size of the noble metal powder in the conductive paste.

19. The glass article according to claim 11 , wherein the glass frit in the conductive paste has a softening point of 350° C. to 600° C.

20. The glass article according to claim 11 , wherein the noble metal powder in the conductive paste contains Ag as a main constituent thereof.

Assignees

• Murata Manufacturing Co

Inventors

• Tsugimoto Shinichi

Classifications

• B22F1/052

  characterised by a mixture of particles of different sizes or by the particle size distribution · CPC title

• C03C2217/452

  Glass · CPC title

• H05B2203/017

  Manufacturing methods or apparatus for heaters · CPC title

• B22F2301/15

  Nickel or cobalt · CPC title

• B22F2007/047

  non-pressurised baking of the paste or slurry containing metal powder · CPC title