Electrode material for aluminum electrolytic capacitors and method for producing same
US-2024301561-A1 · Sep 12, 2024 · US
non-pressurised baking of the paste or slurry containing metal powder
non-pressurised baking of the paste or slurry containing metal powder · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B22F2007/047 |
| Official title | {non-pressurised baking of the paste or slurry containing metal powder} |
| Display label | non-pressurised baking of the paste or slurry containing metal powder |
| Total patents | 158 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 4 |
| 2016 | 4 |
| 2017 | 12 |
| 2018 | 23 |
| 2019 | 12 |
| 2020 | 19 |
| 2021 | 15 |
| 2022 | 24 |
| 2023 | 8 |
| 2024 | 21 |
| 2025 | 12 |
| 2026 | 4 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Methods for Manufacturing Electronic Devices
US-2020352034-A1 · Nov 5, 2020 · US
Method for producing film
US-2020246873-A1 · Aug 6, 2020 · US
Hybrid component with multiple cores and method for treating a component
US-10675686-B2 · Jun 9, 2020 · US
Thick-film pastes containing lead-tellurium-boron-oxides, and their use in the manufacture of semiconductor devices
US-10559703-B2 · Feb 11, 2020 · US
Magnetic tape and magnetic tape device
US-10497389-B2 · Dec 3, 2019 · US
Multilayer ceramic capacitor and manufacturing method of multilayer ceramic capacitor
US-10475581-B2 · Nov 12, 2019 · US
Thick-film pastes containing lead-tellurium-lithium-oxides, and their use in the manufacture of semiconductor devices
US-10468542-B2 · Nov 5, 2019 · US
Sinterable bonding material and semiconductor device using the same
US-10446518-B2 · Oct 15, 2019 · US
Magnetic tape and magnetic tape device
US-2019295590-A1 · Sep 26, 2019 · US
Metal/two-dimensional nanomaterial hybrid conductive film and method for manufacturing same
US-10421123-B2 · Sep 24, 2019 · US
Process for producing a shiny laminate structure at low temperatures
US-10384266-B2 · Aug 20, 2019 · US
Methods of Fabricating Conductive Thick-Film Pastes of Base Metals with High Conductivity Achieved
US-2019143405-A1 · May 16, 2019 · US
Sinter-bonded hybrid article, method for forming hybrid article, and method for closing aperture
US-10265792-B2 · Apr 23, 2019 · US
Fine silver particle dispersion
US-2019103200-A1 · Apr 4, 2019 · US
Low temperature sintering porous metal foam layers for enhanced cooling and processes for forming thereof
US-2019078847-A1 · Mar 14, 2019 · US
Composition and method of producing bonded body
US-2019047046-A1 · Feb 14, 2019 · US
Magnetic tape and magnetic tape device
US-2018350400-A1 · Dec 6, 2018 · US
Joining Materials, Electronic Devices and Methods for Manufacturing Thereof
US-2018338379-A1 · Nov 22, 2018 · US
Joint structure and manufacturing method thereof
US-2018337316-A1 · Nov 22, 2018 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B22F2007/047?
- CPC B22F2007/047 is the Cooperative Patent Classification code for “non-pressurised baking of the paste or slurry containing metal powder.”
- How many patents are filed under CPC B22F2007/047 (non-pressurised baking of the paste or slurry containing metal powder)?
- Our database includes 158 publications tagged with this CPC code.
- Is patent activity under CPC B22F2007/047 growing?
- Publication counts under this code: 21 in 2024 vs 12 in 2025 (latest complete years).