Conductive material, bonding method using the same, and bonded structure

Patent metadata

Field	Value
Publication number	US-10050355-B2
Application number	US-201313868259-A
Country	US
Kind code	B2
Filing date	Apr 23, 2013
Priority date	Nov 19, 2010
Publication date	Aug 14, 2018
Grant date	Aug 14, 2018

Abstract

A conductive material that includes a metal component consisting of a first metal and a second metal having a melting point higher than that of the first metal, wherein the first metal is Sn or an alloy containing 70% by weight or more of Sn, and the second metal is a metal or alloy which forms an intermetallic compound having a melting point of 310° C. or higher with the first metal and has a lattice constant difference of 50% or greater between itself and the intermetallic compound generated at the circumference of the second metal.

First claim

The invention claimed is:

1. A conductive material comprising:
a metal component consisting of a first metal and a second metal, the second metal having a melting point higher than that of the first metal, wherein
the first metal is one of Sn and an alloy containing 70% by weight or more of Sn,
the second metal is a Cu—Mn alloy in which a ratio of Mn to the second metal is 5 to 30% by weight, forms an intermetallic compound having a melting point of 310° C. or higher with the first metal, and has a lattice constant difference of 50% or greater, and
the conductive material contains no other metals that react with the first metal or the second metal.

2. The conductive material according to claim 1 , further comprising a flux component.

3. The conductive material according to claim 1 , wherein the first metal is one of Sn and an alloy containing 85% by weight or more of Sn.

4. The conductive material according to claim 1 , wherein a ratio of the second metal to the metal component is 30% by volume or greater.

5. The conductive material according to claim 1 , wherein the first metal is one of Sn alone and an alloy containing at least one selected from the group consisting of Cu, Ni, Ag, Au, Sb, Zn, Bi, In, Ge, Al, Co, Mn, Fe, Cr, Mg, Mn, Pd, Si, Sr, Te and P and Sn.

6. The conductive material according to claim 1 , wherein the second metal has a specific surface area of 0.05 m 2 ·g −1 or greater.

7. The conductive material according to claim 1 , wherein at least a portion of the first metal is coated on the circumference of the second metal.

8. A method of bonding an object comprising heating the conductive material according to claim 1 so as to form the intermetallic compound and bond the object.

9. A bonded structure in which an object to be bonded is bonded using the conductive material according to claim 1 , the bonded structure comprising a joint, through which the object to be bonded is bonded, having as main components, the second metal derived from the conductive material and an intermetallic compound containing the second metal and Sn, and the ratio of the first metal derived from the conductive material to the entire metal component is 30% by volume or less.

10. The bonded structure according to claim 9 , wherein the intermetallic compound is comprises a Cu—Mn alloy and one of Sn alone and an alloy containing at least one selected from the group consisting of Cu, Ni, Ag, Au, Sb, Zn, Bi, In, Ge, Al, Co, Mn, Fe, Cr, Mg, Mn, Pd, Si, Sr, Te and P and Sn.

11. The bonded structure according to claim 10 , wherein the Cu—Mn alloy is the second metal derived from the conductive material.

12. The bonded structure according to claim 10 , wherein the one of Sn alone and the alloy is the first metal derived from the conductive material.

13. A conductive material comprising:
a metal component consisting of a first metal and a second metal, the second metal having a melting point higher than that of the first metal, wherein
the first metal is one of Sn and an alloy containing 70% by weight or more of Sn,
the second metal is a Cu—Ni alloy in which a ratio of Ni to the second metal is 5 to 20% by weight, forms an intermetallic compound having a melting point of 310° C. or higher with the first metal, and has a lattice constant difference of 50% or greater, and
the conductive material contains no other metals that react with the first metal or the second metal.

14. The conductive material according to claim 13 , further comprising a flux component.

15. The conductive material according to claim 13 , wherein the first metal is one of Sn and an alloy containing 85% by weight or more of Sn.

16. The conductive material according to claim 13 , wherein a ratio of the second metal to the metal component is 30% by volume or greater.

17. The conductive material according to claim 13 , wherein the first metal is one of Sn alone and an alloy containing at least one selected from the group consisting of Cu, Ni, Ag, Au, Sb, Zn, Bi, In, Ge, Al, Co, Mn, Fe, Cr, Mg, Mn, Pd, Si, Sr, Te and P and Sn.

18. The conductive material according to claim 13 , wherein the second metal has a specific surface area of 0.05 m 2 ·g −1 or greater.

19. The conductive material according to claim 13 , wherein at least a portion of the first metal is coated on the circumference of the second metal.

20. A method of bonding an object comprising heating the conductive material according to claim 13 so as to form the intermetallic compound and bond the object.

21. A bonded structure in which an object to be bonded is bonded using the conductive material according to claim 13 , the bonded structure comprising a joint, through which the object to be bonded is bonded, having as main components, the second metal derived from the conductive material and an intermetallic compound containing the second metal and Sn, and the ratio of the first metal derived from the conductive material to the entire metal component is 30% by volume or less.

22. The bonded structure according to claim 21 , wherein the intermetallic compound is comprises a Cu—Ni alloy and one of Sn alone and an alloy containing at least one selected from the group consisting of Cu, Ni, Ag, Au, Sb, Zn, Bi, In, Ge, Al, Co, Mn, Fe, Cr, Mg, Mn, Pd, Si, Sr, Te and P and Sn.

23. The bonded structure according to claim 22 , wherein the Cu—Ni alloy is the second metal derived from the conductive material.

24. The bonded structure according to claim 22 , wherein the one of Sn alone and the alloy is the first metal derived from the conductive material.

Assignees

• Murata Manufacturing Co

Inventors

• Nakano Kosuke
• Takaoka Hidekiyo

Classifications

• B22F1/10

  Metallic powder containing lubricating or binding agents; Metallic powder containing organic material · CPC title

• B22F1/17

  Metallic particles coated with metal · CPC title

• B22F1/052

  characterised by a mixture of particles of different sizes or by the particle size distribution · CPC title

• B23K1/00

  Soldering, e.g. brazing, or unsoldering (B23K3/00 takes precedence) · CPC title

• C22C9/05

  with manganese as the next major constituent · CPC title