Stretchable electronics for artificial skin

US10045843B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10045843-B2
Application numberUS-201615055492-A
CountryUS
Kind codeB2
Filing dateFeb 26, 2016
Priority dateFeb 27, 2015
Publication dateAug 14, 2018
Grant dateAug 14, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A stretchable electronic device for artificial skin and a method of manufacturing the same are disclosed. The stretchable electronic device for artificial skin includes a first encapsulation layer, a heater disposed on the first encapsulation layer, a second encapsulation layer disposed on the heater, a first sensor array layer disposed on the second encapsulation layer, and a third encapsulation layer disposed on the first sensor array layer.

First claim

Opening claim text (preview).

What is claimed is: 1. A stretchable electronic device for artificial skin, comprising: a first encapsulation layer; a heater disposed on the first encapsulation layer; a second encapsulation layer disposed on the heater; a first sensor array layer disposed on the second encapsulation layer; and a third encapsulation layer disposed on the first sensor array layer; wherein the first sensor array layer comprises a first passivation layer, a semiconductor pattern disposed on the first passivation layer, a first metal pattern disposed on the semiconductor pattern, and a second passivation layer disposed on the first metal pattern; and wherein the first sensor array layer comprises a pressure sensor, and the pressure sensor has a cavity in the first passivation layer to expose the semiconductor pattern. 2. The stretchable electronic device of claim 1 , wherein the first sensor array layer comprises at least one selected from a group consisting of a strain sensor, and a temperature sensor. 3. The stretchable electronic device of claim 1 , wherein the semiconductor pattern and the first metal pattern have a serpentine shape. 4. The stretchable electronic device of claim 1 , wherein the semiconductor pattern is a silicon pattern formed by patterning a doped silicon nanomembrane. 5. The stretchable electronic device of claim 1 , wherein the semiconductor pattern is a silicon nanoribbon. 6. The stretchable electronic device of claim 2 , wherein the strain sensor has a Wheatstone bridge configuration. 7. The stretchable electronic device of claim 1 , wherein each of the first encapsulation layer, the second encapsulation layer, and the third encapsulation layer is formed of a silicone polymer or silicone rubber. 8. The stretchable electronic device of claim 7 , wherein the silicone polymer is polydimethylsiloxane (PDMS). 9. A stretchable electronic device for artificial skin, comprising: a first encapsulation layer; a heater disposed on the first encapsulation layer; a second encapsulation layer disposed on the heater; a first sensor array layer disposed on the second encapsulation layer; and a third encapsulation layer disposed on the first sensor array layer, wherein the first sensor array layer comprises a strain sensor and a pressure sensor; and wherein the strain sensor and the pressure sensor have different curvatures depending on a position of a human body to which the stretchable electronic device is attached, and a strain induced by the human body is further relieved with an increase in the curvature. 10. A stretchable electronic device for artificial skin, comprising: a first encapsulation layer; a heater disposed on the first encapsulation layer; a second encapsulation layer disposed on the heater; a first sensor array layer disposed on the second encapsulation layer; and a third encapsulation layer disposed on the first sensor array layer, wherein the first sensor array layer comprises a temperature sensor, and wherein a divergence between I-V curves of the temperature sensor under different strains is decreased with an increase in a curvature of the temperature sensor. 11. A stretchable electronic device for artificial skin, comprising: a first encapsulation layer; a heater disposed on the first encapsulation layer; a second encapsulation layer disposed on the heater; a first sensor array layer disposed on the second encapsulation layer; and a third encapsulation layer disposed on the first sensor array layer, wherein the heater comprises: a third passivation layer, a second metal pattern disposed on the third passivation layer, and a fourth passivation layer disposed on the second metal pattern. 12. The stretchable electronic device of claim 11 , wherein the second metal pattern has a serpentine shape. 13. A stretchable electronic device for artificial skin, comprising: a first encapsulation layer; a heater disposed on the first encapsulation layer; a second encapsulation layer disposed on the heater; a first sensor array layer disposed on the second encapsulation layer; a third encapsulation layer disposed on the first sensor array layer; and a second sensor array layer disposed on the third encapsulation layer, wherein the second sensor array layer comprises a humidity sensor and the humidity sensor detects a change in capacitance induced by a change in permittivity of a sixth passivation layer, into which a water molecule is absorbed. 14. The stretchable electronic device of claim 13 , wherein the humidity sensor comprises: a fifth passivation layer, a third metal pattern disposed on the fifth passivation layer, and a sixth passivation layer disposed on the third metal pattern. 15. The stretchable electronic device of claim 14 , wherein the third metal pattern has a serpentine shape.

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What does patent US10045843B2 cover?
A stretchable electronic device for artificial skin and a method of manufacturing the same are disclosed. The stretchable electronic device for artificial skin includes a first encapsulation layer, a heater disposed on the first encapsulation layer, a second encapsulation layer disposed on the heater, a first sensor array layer disposed on the second encapsulation layer, and a third encapsulati…
Who is the assignee on this patent?
Seoul Nat Univ R&Db Foundation, Inst Basic Science, Samsung Electronics Co Ltd
What technology area does this patent fall under?
Primary CPC classification A61F2/105. Mapped technology areas include Human Necessities.
When was this patent published?
Publication date Tue Aug 14 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).