Gimbal assembly test system and method

US10041976B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10041976-B2
Application numberUS-201615014479-A
CountryUS
Kind codeB2
Filing dateFeb 3, 2016
Priority dateFeb 3, 2016
Publication dateAug 7, 2018
Grant dateAug 7, 2018

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

Aspects of the present disclosure provide a gimbal assembly test system including: a protective cover affixed to a test surface of a wafer probe card mounted within a gimbal bearing, wherein the protective cover includes an exterior surface oriented outward from the test surface of the wafer probe card; and a recess extending into the exterior surface of the protective cover and shaped to matingly engage a load cell tip therein.

First claim

Opening claim text (preview).

We claim: 1. A method for testing a gimbal assembly, the method comprising: imparting a force against an exterior surface of a protective cover affixed to a wafer probe card within the gimbal assembly, wherein the imparting of the force against the exterior surface of the protective cover includes striking a recess extending into the exterior surface with a load cell tip shaped to matingly engage the recess, wherein the recess is laterally offset from a center of the protective cover; measuring a planarity of the wafer probe card relative to the gimbal assembly during the imparting of the force; and calculating a correlation between the force against the protective cover and the planarity of the wafer probe card. 2. The method of claim 1 , further comprising calculating a gimbaling capacity of the gimbal bearing based on the calculated correlation between the force against the protective cover and the planarity of the wafer probe card. 3. The method of claim 2 , further comprising determining whether the gimbaling capacity of the gimbal bearing satisfies a performance standard. 4. The method of claim 1 , wherein the measuring of the planarity of the wafer probe card includes calculating a first height differential between a first point on the protective cover and a reference point.

Assignees

Inventors

Classifications

  • Calibrating; Standards or reference devices, e.g. voltage or resistance standards, "golden" references (G01R33/0035, G01R35/002 take precedence) · CPC title

  • Means for compensating offset magnetic fields or the magnetic flux to be measured; Means for generating calibration magnetic fields · CPC title

  • arranged on a flexible frame or film · CPC title

  • Testing lamps · CPC title

  • Testing of discharge tubes (during manufacture H01J9/42) · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US10041976B2 cover?
Aspects of the present disclosure provide a gimbal assembly test system including: a protective cover affixed to a test surface of a wafer probe card mounted within a gimbal bearing, wherein the protective cover includes an exterior surface oriented outward from the test surface of the wafer probe card; and a recess extending into the exterior surface of the protective cover and shaped to matin…
Who is the assignee on this patent?
Globalfoundries Inc
What technology area does this patent fall under?
Primary CPC classification G01M13/00. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Aug 07 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).