Method for treating a semiconductor device
US-2017095841-A1 · Apr 6, 2017 · US
US10041904B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10041904-B2 |
| Application number | US-201715704695-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 14, 2017 |
| Priority date | Mar 29, 2013 |
| Publication date | Aug 7, 2018 |
| Grant date | Aug 7, 2018 |
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A sensor array includes a plurality of sensors. A sensor of the plurality of sensors has a sensor pad exposed at a surface of the sensor array. A method of treating the sensor array includes exposing at least the sensor pad to a wash solution including sulfonic acid and an organic solvent and rinsing the wash solution from the sensor pad.
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What is claimed is: 1. A method of treating a sensor array, the sensor array including a plurality of sensors, a sensor of the plurality of sensors having a sensor pad exposed at a surface of the sensor array, the method comprising: exposing at least the sensor pad to a wash solution comprising sulfonic acid and an organic solvent; and rinsing the wash solution from the sensor pad. 2. The method of claim 1 , wherein the sulfonic acid includes alkyl sulfonic acid, alkyl aryl sulfonic acid, or a combination thereof. 3. The method of claim 1 , wherein the alkyl aryl sulfonic acid includes an alkyl group having between 1 and 20 carbons. 4. The method of claim 1 , wherein the sulfonic acid includes dodecyl benzene sulfonic acid. 5. The method of claim 1 , wherein the wash solution includes between 10 mM and 500 mM of the sulfonic acid. 6. The method of claim 1 , wherein the wash solution includes between 0.5 wt % and 25 wt % of the sulfonic acid. 7. The method of claim 1 , wherein the organic solvent is non-polar. 8. The method of claim 1 , wherein the organic solvent has a boiling point in a range of 36° C. to 345° C. 9. The method of claim 1 , wherein the organic solvent is an alkane having between 6 and 24 carbons. 10. The method of claim 1 , wherein the organic solvent is a polar aprotic solvent. 11. The method of claim 1 , further comprising heating the sensor pad and the wash solution while exposing the sensor pad to the wash solution at a temperature in a range of 35° C. to 70° C. 12. The method of claim 1 , wherein exposing includes exposing for a period in a range of 30 seconds to 30 minutes. 13. The method of claim 1 , further comprising exposing at least the sensor pad to a basic solution following exposing the sensor pad to the wash solution. 14. The method of claim 1 , wherein rinsing includes rinsing with a rinse organic solvent miscible with water and the organic solvent. 15. The method of claim 10 , wherein the polar aprotic solvent includes tetrahydrofuran, ethylacetate, acetone, dimethylformamide, acetonitrile, dimethyl sulfoxide, N-methyl pyrrolidone, or combinations thereof. 16. The method of claim 13 , wherein the basic solution includes between 0.005M and 1.5M sodium hydroxide. 17. The method of claim 14 , wherein the rinse organic solvent includes alcohol. 18. A method of treating a sensor array, the sensor array including a plurality of sensors, a sensor of the plurality of the sensors including a sensor pad, a well structure disposed over the sensory array and defining wells of a well array corresponding with the sensor array, a well of the well array providing an opening to the sensor pad, a cap attached over the sensor array and the well structure and including a fluid port and a space defined between the cap and the well structure, the method comprising: applying a wash solution through the fluid port into the space and waiting for a first period between 30 seconds and 30 minutes, the wash solution comprising sulfonic acid and an organic solvent; applying a basic solution through the fluid port into the space and waiting for a second period between 20 seconds and 15 minutes; and applying a rinse solution through the fluid port. 19. The method of claim 18 , further comprising repeating applying the wash solution, applying the basic solution, and applying the rinse solution.
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