Method for treating a semiconductor device

Patent metadata

Field	Value
Publication number	US-2017095841-A1
Application number	US-201615387591-A
Country	US
Kind code	A1
Filing date	Dec 21, 2016
Priority date	Mar 26, 2015
Publication date	Apr 6, 2017
Grant date	—

Abstract

A method of treating a sensor array including a plurality of sensors and an isolation structure, where a sensor of the plurality of sensors has a sensor pad exposed at a surface of the sensor array and the isolation structure is disposed between the sensor pad and sensor pads of other sensors of the plurality of sensors, comprises exposing the sensor pad and the isolation structure to a non-aqueous organo-silicon solution including an organo-silicon compound and a first non-aqueous carrier; applying an acid solution including an organic acid and a second non-aqueous carrier to the sensor pad; and rinsing the acid solution from the sensor pad and the isolation structure.

First claim

What is claimed is:

1 . A method of treating a sensor array, the sensor array including a plurality of sensors and an isolation structure, a sensor of the plurality of sensors having a sensor pad exposed at a surface of the sensor array, the isolation structure disposed between the sensor pad and sensor pads of other sensors of the plurality of sensors, the method comprising:
exposing the sensor pad and the isolation structure to a non-aqueous organo-silicon solution including an organo-silicon compound and a first non-aqueous carrier; applying an acid solution including an organic acid and a second non-aqueous carrier to the sensor pad; and rinsing the acid solution from the sensor pad and the isolation structure.

2 . The method of claim 2 , wherein a portion of the organo-silicon compound remains on the isolation structure.

3 . The method of claim 1 , wherein the organo-silicon compound includes a silane functionalized with an aryl, polyaryl, alkyl, alkoxy, halo, or cyano moiety, or any combination thereof.

4 . The method of claim 3 , wherein the silane is selected from the group consisting of phenyldimethylchlorosilane, tert-butylchlorodiiphenylsilane, chlorotripropylsilane, (N,N-dimethylamino) trimethyl-silane, tris(trimethylsilyl)silane, triethylchlorosilane, 3-cyanopropyldimethylchloro-silane, chlorotriethylsilane, 1,2-bis(chlorodimethylsiyl)ethane, trimethylsilyltrifluoronesulfonate, trioctylsilane, dodecyldimethylchlorosilane, chlorodimethylthexylsilane, trimethylchlorosilane, chloro(chloromethyl) dimethylsilane, thexyldimethylchlorosilane, triisopropylchlorosilane, trimethylmethoxysilane, trimethylchlorosilane, chlorotriisopropylsilane, acetoxytrimethylsilane, and a combination thereof.

5 . The method of claim 1 , wherein the organo-silicon compound includes a polysiloxane including aryl, dialkyl or alkylhydro units, or combinations thereof.

6 . The method of claim 5 , wherein the aryl unit includes a phenylalkyl siloxyl unit.

7 . The method of claim 5 , wherein the dilkyl unit or the alkylhydro unit includes an alkyl moiety selected from methyl, ethyl, propyl, butyl moieties, and a combination thereof.

8 . The method of claim 7 , wherein the organo-silicon compound include a siloxane selected from the group consisting of an alkyl terminated polydimethylsiloxane, a hydride-terminated polydimethylsiloxane, a monovinyl terminated polydimethylsiloxane, dichloro-tetramethyldisiloxane, hexamethyltrisiloxane, polymethylhydrosiloxane, tris(trimethylsilyloxy)silane, octamethyltrisiloxane, and a combination thereof.

9 . The method of claim 1 , wherein the organo-silicon compound includes a polysiloxane including hydrophilic, polar, or amphiphilic units, or combinations thereof.

10 . The method of claim 1 , wherein the organo-silicon compound includes a silazane.

11 . The method of claim 1 , wherein the organo-silicon compound has a molecular weight in a range of 50 Da to 10000 Da.

12 . The method of claim 1 , wherein the treatment solution includes the organo-silicon compound in an amount of 0.001% to 10.0% by weight.

13 . The method of claim 1 , wherein the treatment solution further includes a platinum compound.

14 . The method of claim 1 , wherein the organic acid includes sulfonic acid.

15 . The method of claim 14 , wherein the sulfonic acid includes dodecyl benzene sulfonic acid.

16 . The method of claim 1 , wherein the treatment solution includes between 0.5 wt % and 25 wt % of the acid.

17 . The method of claim 1 , wherein the organic solvent is an alkane having between 6 and 24 carbons.

18 . The method of claim 1 , further comprising heating the sensor pad and the treatment solution while exposing the sensor pad to the treatment solution.

19 . The method of claim 1 , further comprising exposing at least the sensor pad to a basic solution.

20 . The method of claim 19 , wherein the basic solution includes between 0.005M and 1.5M sodium hydroxide.

Assignees

• Life Technologies Corp

Inventors

• Ball James A
• Waggoner Phil
• Parker Scott

Classifications

• H10P70/20

  Cleaning during device manufacture · CPC title

• G01N27/414

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• B08B3/08 Primary

  the liquid having chemical or dissolving effect · CPC title

• B08B9/08

  Cleaning containers, e.g. tanks · CPC title

• G01N27/4148

  Integrated circuits therefor, e.g. fabricated by CMOS processing · CPC title