Adsorption heat exchanger devices

US10041709B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10041709-B2
Application numberUS-201715413059-A
CountryUS
Kind codeB2
Filing dateJan 23, 2017
Priority dateJun 30, 2011
Publication dateAug 7, 2018
Grant dateAug 7, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Adsorption heat exchanger devices (11, 25) are provided for use in solid sorption refrigeration systems (1) together with methods for making such devices and adsorbent structures therefor. The methods include applying a curable binder, in solution in a solvent, to granular adsorbent material, and then evaporating the solvent and curing the binder. The curable binder solution is sufficiently dilute that, during evaporation of the solvent, the binder becomes concentrated around contact points between granules (18) of the adsorbent material whereby localized bonds (19) are formed around the contact points on curing of the binder.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for making an adsorbent structure for an adsorption heat exchanger device, the method comprising: applying a curable binder solution to a granular adsorbent material, wherein the granular adsorbent material comprises granules with polar surfaces; evaporating a solvent in the curable binder solution; curing a binder, wherein the binder is in the curable binder solution; breaking the granular adsorbent material into clusters of bonded granules; coating a surface of at least one cavity formed at an adsorption side of a heat exchanger structure with a binder for bonding the clusters to said surface; and stacking the clusters in the at least one cavity, wherein the curable binder solution is diluted so that during the evaporating of the solvent the binder becomes concentrated around contact points between granules of the granular adsorbent material, and wherein localized bonds are formed around the contact points upon curing of the curable binder. 2. The method as claimed in claim 1 , wherein the curable binder solution contains the binder in a ratio by mass of 1:5 from binder to solvent. 3. The method according to claim 1 , wherein the binder shrinks upon curing the binder. 4. The method as claimed in claim 3 , wherein the curable binder shrinks by at least 3% upon curing the binder. 5. The method as claimed in claim 1 , wherein the curable binder comprises an adhesive mixture. 6. A method for making an adsorbent structure for an adsorption heat exchanger device, the method comprising: applying a curable binder solution to a granular adsorbent material; evaporating a solvent in the curable binder solution; curing a binder, wherein the binder is in the curable binder solution, and wherein the binder shrinks upon curing the binder; breaking the granular adsorbent material into clusters of bonded granules; coating a surface of at least one cavity formed at an adsorption side of a heat exchanger structure with a binder for bonding the clusters to said surface; and stacking the clusters in the at least one cavity of the heat exchanger structure, wherein the curable binder solution is diluted so that during the evaporating of the solvent the binder becomes concentrated around contact points between granules of the granular adsorbent material, and wherein localized bonds are formed around the contact points upon curing of the curable binder. 7. The method as claimed in claim 6 , wherein the curable binder solution contains the binder in a ratio by mass of 1:5 from binder to solvent. 8. The method as claimed in claim 6 , wherein the curable binder shrinks by at least 3% upon curing the binder. 9. The method as claimed in claim 6 , wherein the granular adsorbent material comprises granules with polar surfaces.

Assignees

Inventors

Classifications

  • F25B35/04Primary

    using a solid as sorbent · CPC title

  • Use of binding agents; addition of materials ameliorating the mechanical properties of the produced sorbent · CPC title

  • Sorption machines, plants or systems, operating continuously, e.g. absorption type · CPC title

  • Heat exchanger or boiler making · CPC title

  • Sorbents comprising a binder, e.g. for forming aggregated, agglomerated or granulated products · CPC title

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What does patent US10041709B2 cover?
Adsorption heat exchanger devices (11, 25) are provided for use in solid sorption refrigeration systems (1) together with methods for making such devices and adsorbent structures therefor. The methods include applying a curable binder, in solution in a solvent, to granular adsorbent material, and then evaporating the solvent and curing the binder. The curable binder solution is sufficiently dil…
Who is the assignee on this patent?
IBM
What technology area does this patent fall under?
Primary CPC classification F25B35/04. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Aug 07 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).