Adsorption heat exchanger devices

US9821418B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9821418-B2
Application numberUS-201214128822-A
CountryUS
Kind codeB2
Filing dateJun 8, 2012
Priority dateJun 30, 2011
Publication dateNov 21, 2017
Grant dateNov 21, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Adsorption heat exchanger devices ( 11, 25 ) are provided for use in solid sorption refrigeration systems ( 1 ) together with methods for making such devices and adsorbent structures therefor. The methods include applying a curable binder, in solution in a solvent, to granular adsorbent material, and then evaporating the solvent and curing the binder. The curable binder solution is sufficiently dilute that, during evaporation of the solvent, the binder becomes concentrated around contact points between granules ( 18 ) of the adsorbent material whereby localized bonds ( 19 ) are formed around the contact points on curing of the binder.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method for making an adsorbent structure for an adsorption heat exchanger device, the method comprising: applying a curable binder solution that is in a solvent, to a granular adsorbent material having granules with polar surfaces, wherein there is a charge separation at a level of inter-atomic bonding at the surfaces of the granules; exposing the granular adsorbent material to oxidative conditions to increase concentrations of oxygen-containing functional groups on a surface of the granular adsorbent material, wherein said exposing of the granular adsorbent material to oxidative conditions includes treating the granular adsorbent material with one of O2, H2O2, HNO3, and H2SO4, and wherein the oxygen-containing functional groups include one of —O—, —OH and ═O; evaporating the solvent; curing a binder, wherein the binder is in the curable binder solution; wherein the curable binder solution is diluted so that during the evaporating of the solvent the binder becomes concentrated around contact points between the granules of the granular adsorbent material; and wherein localized bonds are formed around the contact points upon curing of the curable binder; and treating a heat exchanger surface to which a granular adsorbent material is to be bonded to render the heat exchanger surface polar. 2. The method according to claim 1 , further comprising: applying the curable binder solution to the granular adsorbent material. 3. The method as claimed in claim 2 , further comprising: stacking the granular adsorbent material on a heat exchanger structure; and applying the curable binder solution to the adsorbent material, wherein additional localized bonds are formed around the contact points between the heat exchanger structure and the granules of the granular adsorbent material upon curing of the binder. 4. The method as claimed in claim 1 , further comprising: stacking the adsorbent material in at least one cavity of the heat exchanger structure. 5. The method as claimed in claim 1 , wherein the curable binder solution contains the binder in a ratio by mass of 1:5 from binder to solvent. 6. The method according to claim 1 , wherein the binder shrinks upon curing the binder. 7. The method as claimed in claim 6 , wherein the curable binder shrinks by at least 3% upon curing the binder. 8. The method as claimed in claim 3 , wherein said treating the heat exchanger surface to which the granular adsorbent material is to be bonded to render the heat exchanger surface polar is performed prior to said bonding with the granular adsorbent material. 9. The method as claimed in claim 1 , wherein the curable binder comprises an adhesive mixture. 10. A method for making an adsorbent structure for an adsorption heat exchanger device, the method comprising: applying a curable binder solution that is in a solvent, to a granular adsorbent material having granules with polar surfaces, wherein there is a charge separation at a level of inter-atomic bonding at the surfaces of the granules; exposing the granular adsorbent material to oxidative conditions to increase concentrations of oxygen-containing functional groups on a surface of the granular adsorbent material, wherein said exposing of the granular adsorbent material to oxidative conditions includes treating the granular adsorbent material with one of O2, H2O2, HNO3, and H2SO4, and wherein the oxygen-containing functional groups include one of —O—, —OH and ═O; evaporating the solvent; curing a binder, wherein the binder is in the curable binder solution; wherein the curable binder solution is diluted so that during the evaporating of the solvent the binder becomes concentrated around contact points between granules of the granular adsorbent material; and wherein localized bonds are formed around the contact points upon curing of the binder; treating a heat exchanger surface to render the heat exchanger surface polar; and stacking the granular adsorbent material on the heat exchanger surface. 11. The method according to claim 10 , further comprising applying the curable binder solution to the granular adsorbent material, wherein additional localized bonds are formed around the contact points between a heat exchanger structure and the granules of the granular adsorbent material upon curing of the binder. 12. The method according to claim 11 , further comprising stacking the granular adsorbent material in at least one cavity of the heat exchanger structure. 13. The method according to claim 10 , wherein the curable binder solution contains the binder in a ratio by mass of 1:5 from binder to solvent. 14. The method according to claim 10 , wherein the binder shrinks upon curing the binder. 15. The method according to claim 10 , wherein the curable binder shrinks by at least 3% upon curing the binder. 16. The method according to claim 10 , wherein said treating the heat exchanger surface to which the granular adsorbent material is to be bonded to render the heat exchanger surface polar is performed prior to said stacking with the granular adsorbent material. 17. The method according to claim 10 , wherein the curable binder solution comprises an adhesive mixture. 18. A method for making an adsorbent structure for an adsorption heat exchanger device, the method comprising: applying a curable binder solution that is in a solvent, to a granular adsorbent material having granules with polar surfaces, wherein there is a charge separation at a level of inter-atomic bonding at the surfaces of the granules, wherein the curable binder solution comprises an adhesive mixture; exposing the granular adsorbent material to oxidative conditions to increase concentrations of oxygen-containing functional groups on a surface of the granular adsorbent material, wherein said exposing of the granular adsorbent material to oxidative conditions includes treating the granular adsorbent material with one of O2, H2O2, HNO3, and H2SO4, and wherein the oxygen-containing functional groups include one of —O—, —OH and ═O; evaporating the solvent; curing a binder, wherein the binder is in the curable binder solution, wherein the binder shrinks upon curing the binder; wherein the curable binder solution is diluted so that during the evaporating of the solvent the binder becomes concentrated around contact points between granules of the granular adsorbent material; and wherein localized bonds are formed around the contact points upon curing of the binder; treating a heat exchanger surface to render the heat exchanger surface polar; and stacking the granular adsorbent material on the heat exchanger surface.

Assignees

Inventors

Classifications

  • Heat exchanger or boiler making · CPC title

  • B23P15/26Primary

    heat exchangers {or the like (making heat exchangers by methods covered by other subclasses B21D53/02)} · CPC title

  • Use of binding agents; addition of materials ameliorating the mechanical properties of the produced sorbent · CPC title

  • using a solid as sorbent · CPC title

  • Sorbents comprising a binder, e.g. for forming aggregated, agglomerated or granulated products · CPC title

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What does patent US9821418B2 cover?
Adsorption heat exchanger devices ( 11, 25 ) are provided for use in solid sorption refrigeration systems ( 1 ) together with methods for making such devices and adsorbent structures therefor. The methods include applying a curable binder, in solution in a solvent, to granular adsorbent material, and then evaporating the solvent and curing the binder. The curable binder solution is sufficiently…
Who is the assignee on this patent?
Brunschwiler Thomas J, Goicochea Javier V, Michel Bruno, and 2 more
What technology area does this patent fall under?
Primary CPC classification B23P15/26. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Nov 21 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).