Light source and method of mounting light-emitting device

Patent metadata

Field	Value
Publication number	US-10041663-B2
Application number	US-201715683392-A
Country	US
Kind code	B2
Filing date	Aug 22, 2017
Priority date	Sep 21, 2016
Publication date	Aug 7, 2018
Grant date	Aug 7, 2018

Abstract

A light source includes: a mounting substrate; and a side-view type light-emitting device including: a substrate; through holes; a front electrode; a rear electrode; side electrodes; and a light-emitting element, wherein: land patterns are formed on a front surface of the mounting substrate, in positions corresponding to the through holes, each land pattern having an inverted “T” shape composed of a narrow region and a wide region; the light-emitting device is arranged such that the cross sectional shape of the through hole in the long side direction of the substrate is aligned with the shape of the narrow region of the land pattern, in a plan view; and solder members are formed in a wall shape on the mounting substrate, are formed in the through holes on the mounting substrate, and connects the rear electrode and the side electrode to the wide region and the narrow region, respectively.

First claim

What is claimed is:

1. A light source comprising:
a mounting substrate; and
a side-view type light-emitting device, mounted on the mounting substrate, the light-emitting device including:
a substrate having an oblong shape;
through holes provided at both ends of the substrate and formed to pass through the substrate;
a front electrode provided on a front surface of the substrate;
a rear electrode provided on a rear surface of the substrate;
side electrodes provided on side surfaces of the through holes and connecting the front electrode and the rear electrode to each other; and
an oblong flip chip type light-emitting element provided on the front surface of the substrate and connected to the front electrode, wherein:

the through holes are formed by cutting a long side of the substrate;
land patterns are formed on a front surface of the mounting substrate, in positions corresponding to the through holes, each land pattern having an inverted “T” shape composed of a narrow region and a wide region having a wider width than the narrow region, the narrow region having a shape identical to a cross sectional shape of the through hole in a long side direction of the substrate;
the light-emitting device is arranged such that the cross sectional shape of the through hole in the long side direction of the substrate is aligned with the shape of the narrow region of the land pattern, in a plan view; and
solder members are formed in a wall shape on the mounting substrate, are formed in the through holes on the mounting substrate, and connects the rear electrode and the side electrode to the wide region and the narrow region, respectively.

2. The light source according to claim 1 , wherein
a width of the wide region in a long side direction of the substrate is larger than a width of the narrow region in the long side direction of the substrate by 30% or more.

3. The light source according to claim 1 , wherein
a width of the wide region in a short side direction of the substrate is larger than a width of the narrow region in the short side direction of the substrate by 50% or more.

4. The light source according to claim 1 , wherein
the rear electrode has a rectangular pattern connected to the side electrode and an oblong pattern extending from the rectangular pattern in the long side direction of the substrate and has a constricted portion in a connection portion by which the rectangular pattern and the oblong pattern are connected to each other, the constricted portion being arranged near the through hole.

5. The light source according to claim 1 , wherein
a plurality of the light-emitting devices are arranged at intervals on the mounting substrate, and an interval between the light-emitting elements in one light-emitting device of the light-emitting devices is set to be equal to an interval between the light-emitting elements in the respective light-emitting devices adjacent to each other.

6. A method of mounting a side-view type light-emitting device on a mounting substrate, the light-emitting device including: a substrate having an oblong shape; through holes provided at both ends of the substrate and formed to pass through the substrate; a front electrode provided on a front surface of the substrate; a rear electrode provided on a rear surface of the substrate; side electrodes provided on side surfaces of the through holes and connecting the front electrode and the rear electrode to each other; and an oblong flip chip type light-emitting element provided on the front surface of the substrate and connected to the front electrode, in which the through holes being formed by cutting long sides of the substrate, the method comprising:
forming a land pattern on a front surface of the mounting substrate, in a position corresponding to the through hole, the land pattern having an inverted “T” shape composed of a narrow region and a wide region having a wider width than the narrow region, the narrow region having a shape identical to a cross sectional shape of the through hole in a long side direction of the substrate;
forming a solder member on the land pattern;
arranging the light-emitting device such that the cross sectional shape of the through hole in the long side direction of the substrate is aligned with the shape of the narrow region of the land pattern, in a plan view; and
melting the solder member through heat treatment such that the solder member is formed in a wall shape on the mounting substrate and is formed in the through hole on the mounting substrate, thereby connecting the rear electrode and the side electrode to the wide region and the narrow region, respectively.

Assignees

• Toyota Gosei Co Ltd
• Toyoda Gosei Kk

Inventors

• Tanaka Motoyuki
• Tsuchiya Yosuke
• Kawaoka Aya
• Ishida Makoto
• Ito Yuhki

Classifications

• G02F1/1335

  Structural association of cells with optical devices, e.g. polarisers or reflectors · CPC title

• H05K3/3431

  Leadless components · CPC title

• H05K3/3442

  having edge contacts, e.g. leadless chip capacitors, chip carriers · CPC title

• H05K2201/09472

  Recessed pad for surface mounting; Recessed electrode of component · CPC title

• H05K2201/10106

  Light emitting diode [LED] · CPC title