Heat releasing semiconductor chip package and method for manufacturing the same
US-2015371924-A1 · Dec 24, 2015 · US
Light emitting device
US2016336494A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016336494-A1 |
| Application number | US-201615219627-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jul 26, 2016 |
| Priority date | May 21, 2014 |
| Publication date | Nov 17, 2016 |
| Grant date | — |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A light emitting device includes a substrate having a first main surface that serves as the light extraction surface, a second main surface that is opposite the first main surface, and a mounting surface that is adjacent to at least the second main surface, and that is provided an insulating base material, a pair of connection terminals disposed on the second main surface, and a heat dissipation terminal disposed on the second main surface and between the pair of connection terminals; a light emitting element that is mounted on the first main surface of the substrate and; a sealing member that seals the light emitting element and is formed substantially in the same plane as the substrate on the mounting surface.
First claim
Opening claim text (preview).
What is claimed is: 1 . A light emitting device comprising: a substrate having a first main surface, a second main surface that is opposite the first main surface, and a mounting surface that is adjacent to at least the second main surface, and that includes an insulating base material, a pair of connection terminals disposed on the second main surface, a solder resist disposed on the second main surface, and a metal film disposed on the second main surface, at least part of the metal film being covered by the solder resist such that an exposed part of the metal film is defined and serves as a heat dissipation terminal between the pair of connection terminals, a light emitting element that is mounted on the first main surface of the substrate in flip-chip manner and, a light blocking sealing member that seals the light emitting element and is formed substantially in the same plane as the substrate on the mounting surface.
Assignees
Inventors
Classifications
between a chip and a stacked insulating package substrate, interposer or RDL · CPC title
Package configurations · CPC title
Encapsulations · CPC title
- H10H20/858Primary
Means for heat extraction or cooling · CPC title
- H01L33/54Primary
Electricity · mapped topic
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US2016336494A1 cover?
- A light emitting device includes a substrate having a first main surface that serves as the light extraction surface, a second main surface that is opposite the first main surface, and a mounting surface that is adjacent to at least the second main surface, and that is provided an insulating base material, a pair of connection terminals disposed on the second main surface, and a heat dissipatio…
- Who is the assignee on this patent?
- Nichia Corp
- What technology area does this patent fall under?
- Primary CPC classification H10H20/858. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Nov 17 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).