Epoxy resin formulations and processes for producing aerospace-grade composites via low temperature, isothermal infusion
US-2024376278-A1 · Nov 14, 2024 · US
US10040914B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10040914-B2 |
| Application number | US-201615336503-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 27, 2016 |
| Priority date | May 13, 2013 |
| Publication date | Aug 7, 2018 |
| Grant date | Aug 7, 2018 |
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Compositions and methods for forming epoxy resin are provided, and compositions and methods for forming epoxy resin composites are provided. In one embodiment, a composite comprises an epoxy resin composition comprising an epoxy resin component comprising a glycidyl ether of an aryl substituted phenolic compound, a curing agent component, and a substrate. In one embodiment, a composite comprises an epoxy resin composition comprising an epoxy resin component and a curing agent component comprising an aryl substituted phenolic compound, and a substrate.
Opening claim text (preview).
What is claimed is: 1. A composite, comprising: an epoxy resin composition comprising: an epoxy resin component; and a curing agent component comprising an aryl substituted phenolic compound with the aryl substituent free of active hydrogen groups; and a substrate, wherein the aryl substituted phenolic compound is selected from the group consisting of an arylhydroquinone with the aryl group free of active hydrogen groups, an arylresorcinol with the aryl group free of active hydrogen groups, and combinations thereof. 2. The composite of claim 1 , wherein the aryl substituted phenolic compound is selected from the group of 4-phenylresorcinol, 5-phenylresorcinol, 2-phenylhydroquinone, 2,5-diphenylhydroquinone, and combinations thereof. 3. The composite of claim 1 , wherein the epoxy resin composition comprises: from about 10 wt. % to about 95 wt. % of the epoxy resin component; and from about 90 wt. % to about 5 wt. % of the curing agent component, wherein the total component wt. % comprises 100 wt. %. 4. The composite of claim 1 , wherein the epoxy resin component is free of a glycidyl ether of an aryl substituted phenolic compound with the aryl substituent free of an epoxy containing substituent. 5. The composite of claim 1 , wherein the curing agent component further comprises an amine-containing component. 6. The composite of claim 1 , wherein the epoxy resin component comprises from about 10 vol. % to 99.5 vol. % of the composite. 7. The composite of claim 1 , wherein the substrate comprises a reinforcing fiber substrate.
with epihalohydrins · CPC title
Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title
Epoxynovolacs · CPC title
as impregnant, bonding, or embedding substance {(not used)} · CPC title
aromatic · CPC title
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