Blank for mold production and method for manufacturing mold

US10040220B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10040220-B2
Application numberUS-201615235461-A
CountryUS
Kind codeB2
Filing dateAug 12, 2016
Priority dateMay 16, 2012
Publication dateAug 7, 2018
Grant dateAug 7, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A hard mask film 2 provided on substrate 1 is formed by tin-containing chromium-containing material. In the chromium-containing material including tin, which forms the hard mask film 2, the etching resistance to fluorine-containing dry etching is equal to or higher than the etching resistance of the tin-free chromium-containing material, and it shows a significantly high etching rate as compared with a chromium-containing material free of tin under conditions for chlorine-containing dry etching. As a result, the time for chlorine-containing dry etching is shortened, and damage to a resist pattern is reduced. Thus, high-precision pattern transfer can be performed. The present invention provides a novel technique for increasing etching process-ability by increasing a dry-etching rate of a hard mask film made of a chromium-containing material while assuring a hard mask function of the hard mask film.

First claim

Opening claim text (preview).

The invention claimed is: 1. A blank for mold production comprising: a hard mask film comprising a material comprising chromium and tin, and a substrate comprising a silicon-containing material, wherein the hard mask film is in direct contact with the silicon-containing material of the substrate, and the hard mask film has a thickness of 1 to 10 nm, and wherein the material comprising chromium and tin has a content of tin of from 0.01 to 2 times the content of chromium in atomic ratio. 2. The blank for mold production according to claim 1 , wherein the material comprising chromium and tin is selected from the group consisting of a tin-chromium metal, a tin-chromium oxide, a tin-chromium nitride, a tin-chromium carbide, a tin-chromium oxide nitride, a tin-chromium oxide carbide, a tin-chromium nitride carbide, and a tin-chromium oxide nitride carbide. 3. The blank for mold production according to claim 1 , wherein the substrate is a quartz substrate. 4. The blank for mold production according to claim 1 , wherein the material comprising chromium and tin is a tin-chromium metal. 5. The blank for mold production according to claim 1 , wherein the material comprising chromium and tin is a tin-chromium oxide. 6. The blank for mold production according to claim 1 , wherein the material comprising chromium and tin is a tin-chromium nitride. 7. The blank for mold production according to claim 1 , wherein the material comprising chromium and tin is a tin-chromium carbide. 8. The blank for mold production according to claim 1 , wherein the material comprising chromium and tin is a tin-chromium oxide nitride. 9. The blank for mold production according to claim 1 , wherein the material comprising chromium and tin is a tin-chromium oxide carbide. 10. The blank for mold production according to claim 1 , wherein the material comprising chromium and tin is a tin-chromium nitride carbide. 11. The blank for mold production according to claim 1 , wherein the material comprising chromium and tin is a tin-chromium oxide nitride carbide.

Assignees

Inventors

Classifications

  • Absorbers, e.g. of opaque materials · CPC title

  • Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping · CPC title

  • specially adapted for use as photomask · CPC title

  • Manufacture or treatment of nanostructures · CPC title

  • containing chromium oxide or chrome ore · CPC title

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What does patent US10040220B2 cover?
A hard mask film 2 provided on substrate 1 is formed by tin-containing chromium-containing material. In the chromium-containing material including tin, which forms the hard mask film 2, the etching resistance to fluorine-containing dry etching is equal to or higher than the etching resistance of the tin-free chromium-containing material, and it shows a significantly high etching rate as compare…
Who is the assignee on this patent?
Shinetsu Chemical Co
What technology area does this patent fall under?
Primary CPC classification B82Y10/00. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Aug 07 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).