Blank for mold production and method for manufacturing mold

US9440375B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9440375-B2
Application numberUS-201313892523-A
CountryUS
Kind codeB2
Filing dateMay 13, 2013
Priority dateMay 16, 2012
Publication dateSep 13, 2016
Grant dateSep 13, 2016

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A hard mask film 2 provided on substrate 1 is formed by tin-containing chromium-containing material. In the chromium-containing material including tin, which forms the hard mask film 2 , the etching resistance to fluorine-containing dry etching is equal to or higher than the etching resistance of the tin-free chromium-containing material, and it shows a significantly high etching rate as compared with a chromium-containing material free of tin under conditions for chlorine-containing dry etching. As a result, the time for chlorine-containing dry etching is shortened, and damage to a resist pattern is reduced. Thus, high-precision pattern transfer can be performed. The present invention provides a novel technique for increasing etching process-ability by increasing a dry-etching rate of a hard mask film made of a chromium-containing material while assuring a hard mask function of the hard mask film.

First claim

Opening claim text (preview).

The invention claimed is: 1. A blank for mold production comprising: a hard mask film comprising a material comprising chromium and tin, and a substrate capable of being etched by fluorine-containing dry etching, wherein the hard mask film is disposed on the substrate, and the hard mask film has a thickness of 1 to 10 nm, wherein the material comprising chromium and tin has a content of tin of not under 0.01 times the content of chromium in atomic ratio and not over 2 times the content of chromium in atomic ratio, and the concentration of tin in the material comprising chromium and tin varies in a thickness direction of the material, and wherein the substrate capable of being etched by fluorine-containing dry etching is a substrate comprising a silicon-containing material. 2. The blank according to claim 1 , wherein the material comprising chromium and tin is selected from the group consisting of a tin-chromium metal, a tin-chromium oxide, a tin-chromium nitride, a tin-chromium carbide, a tin-chromium oxide nitride, a tin-chromium oxide carbide, a tin-chromium nitride carbide, and a tin-chromium oxide nitride carbide. 3. The blank according to claim 1 , wherein the substrate capable of being etched by fluorine-containing dry etching is a quartz substrate. 4. A method for manufacturing a mold using the blank according to claim 1 , the method comprising: etching the hard mask film comprising the material comprising chromium and tin by chlorine-containing dry etching to form a hard mask pattern; and etching the substrate by fluorine-containing dry etching using the hard mask pattern. 5. The method for manufacturing a mold according to claim 4 , wherein the material comprising chromium and tin is selected from the group consisting of a tin-chromium metal, a tin-chromium oxide, a tin-chromium nitride, a tin-chromium carbide, a tin-chromium oxide nitride, a tin-chromium oxide carbide, a tin-chromium nitride carbide, and a tin-chromium oxide nitride carbide. 6. The method for manufacturing a mold according to claim 4 , wherein the substrate capable of being etched by fluorine-containing dry etching is a quartz substrate. 7. The blank according to claim 1 , wherein the material comprising chromium and tin is a tin-chromium metal. 8. The blank according to claim 1 , wherein the material comprising chromium and tin is a tin-chromium oxide. 9. The blank according to claim 1 , wherein the material comprising chromium and tin is a tin-chromium nitride. 10. The blank according to claim 1 , wherein the material comprising chromium and tin is a tin-chromium carbide. 11. The blank according to claim 1 , wherein the material comprising chromium and tin is a tin-chromium oxide nitride. 12. The blank according to claim 1 , wherein the material comprising chromium and tin is a tin-chromium oxide carbide. 13. The blank according to claim 1 , wherein the material comprising chromium and tin is a tin-chromium nitride carbide. 14. The blank according to claim 1 , wherein the material comprising chromium and tin is a tin-chromium oxide nitride carbide.

Assignees

Inventors

Classifications

  • B82Y10/00Primary

    Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic · CPC title

  • containing chromium oxide or chrome ore · CPC title

  • Oxides (C03C17/02 takes precedence) · CPC title

  • based on carbides {or oxycarbides (containing free metal binder C22C29/00)} · CPC title

  • Absorbers, e.g. of opaque materials · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9440375B2 cover?
A hard mask film 2 provided on substrate 1 is formed by tin-containing chromium-containing material. In the chromium-containing material including tin, which forms the hard mask film 2 , the etching resistance to fluorine-containing dry etching is equal to or higher than the etching resistance of the tin-free chromium-containing material, and it shows a significantly high etching rate as c…
Who is the assignee on this patent?
Shinetsu Chemical Co
What technology area does this patent fall under?
Primary CPC classification B82Y10/00. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Sep 13 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).