Half-tone phase shift mask blank and method for manufacturing half-tone phase shift mask
US-9158192-B2 · Oct 13, 2015 · US
US9440375B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9440375-B2 |
| Application number | US-201313892523-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 13, 2013 |
| Priority date | May 16, 2012 |
| Publication date | Sep 13, 2016 |
| Grant date | Sep 13, 2016 |
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A hard mask film 2 provided on substrate 1 is formed by tin-containing chromium-containing material. In the chromium-containing material including tin, which forms the hard mask film 2 , the etching resistance to fluorine-containing dry etching is equal to or higher than the etching resistance of the tin-free chromium-containing material, and it shows a significantly high etching rate as compared with a chromium-containing material free of tin under conditions for chlorine-containing dry etching. As a result, the time for chlorine-containing dry etching is shortened, and damage to a resist pattern is reduced. Thus, high-precision pattern transfer can be performed. The present invention provides a novel technique for increasing etching process-ability by increasing a dry-etching rate of a hard mask film made of a chromium-containing material while assuring a hard mask function of the hard mask film.
Opening claim text (preview).
The invention claimed is: 1. A blank for mold production comprising: a hard mask film comprising a material comprising chromium and tin, and a substrate capable of being etched by fluorine-containing dry etching, wherein the hard mask film is disposed on the substrate, and the hard mask film has a thickness of 1 to 10 nm, wherein the material comprising chromium and tin has a content of tin of not under 0.01 times the content of chromium in atomic ratio and not over 2 times the content of chromium in atomic ratio, and the concentration of tin in the material comprising chromium and tin varies in a thickness direction of the material, and wherein the substrate capable of being etched by fluorine-containing dry etching is a substrate comprising a silicon-containing material. 2. The blank according to claim 1 , wherein the material comprising chromium and tin is selected from the group consisting of a tin-chromium metal, a tin-chromium oxide, a tin-chromium nitride, a tin-chromium carbide, a tin-chromium oxide nitride, a tin-chromium oxide carbide, a tin-chromium nitride carbide, and a tin-chromium oxide nitride carbide. 3. The blank according to claim 1 , wherein the substrate capable of being etched by fluorine-containing dry etching is a quartz substrate. 4. A method for manufacturing a mold using the blank according to claim 1 , the method comprising: etching the hard mask film comprising the material comprising chromium and tin by chlorine-containing dry etching to form a hard mask pattern; and etching the substrate by fluorine-containing dry etching using the hard mask pattern. 5. The method for manufacturing a mold according to claim 4 , wherein the material comprising chromium and tin is selected from the group consisting of a tin-chromium metal, a tin-chromium oxide, a tin-chromium nitride, a tin-chromium carbide, a tin-chromium oxide nitride, a tin-chromium oxide carbide, a tin-chromium nitride carbide, and a tin-chromium oxide nitride carbide. 6. The method for manufacturing a mold according to claim 4 , wherein the substrate capable of being etched by fluorine-containing dry etching is a quartz substrate. 7. The blank according to claim 1 , wherein the material comprising chromium and tin is a tin-chromium metal. 8. The blank according to claim 1 , wherein the material comprising chromium and tin is a tin-chromium oxide. 9. The blank according to claim 1 , wherein the material comprising chromium and tin is a tin-chromium nitride. 10. The blank according to claim 1 , wherein the material comprising chromium and tin is a tin-chromium carbide. 11. The blank according to claim 1 , wherein the material comprising chromium and tin is a tin-chromium oxide nitride. 12. The blank according to claim 1 , wherein the material comprising chromium and tin is a tin-chromium oxide carbide. 13. The blank according to claim 1 , wherein the material comprising chromium and tin is a tin-chromium nitride carbide. 14. The blank according to claim 1 , wherein the material comprising chromium and tin is a tin-chromium oxide nitride carbide.
Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic · CPC title
containing chromium oxide or chrome ore · CPC title
Oxides (C03C17/02 takes precedence) · CPC title
based on carbides {or oxycarbides (containing free metal binder C22C29/00)} · CPC title
Absorbers, e.g. of opaque materials · CPC title
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