Joined body, electronic device, projector, and manufacturing method of joined body

Patent metadata

Field	Value
Publication number	US-10036942-B2
Application number	US-201615237995-A
Country	US
Kind code	B2
Filing date	Aug 16, 2016
Priority date	Aug 18, 2015
Publication date	Jul 31, 2018
Grant date	Jul 31, 2018

Abstract

A light emitting device includes a semiconductor light emitting element; a mounting substrate; a support substrate; a joining layer which joins the semiconductor light emitting element and the mounting substrate together, is a sintered body of metal particles, and has a pore; and a joining layer which joins the mounting substrate and the support substrate together, is a sintered body of metal particles, and has a pore, in which a porosity of the joining layer is lower than a porosity of the joining layer.

First claim

What is claimed is:

1. A joined body comprising:
a first member which is an exothermic body;
a second member;
a third member;
a first joining layer which joins the first member and the second member together, is a sintered body of metal particles, and has a pore; and
a second joining layer which joins the second member and the third member together, is a sintered body of metal particles, and has a pore,
wherein a porosity of the first joining layer is lower than a porosity of the second joining layer.

2. The joined body according to claim 1 ,
wherein a difference between a thermal expansion coefficient of the first member and a thermal expansion coefficient of the second member is less than a difference between the thermal expansion coefficient of the second member and a thermal expansion coefficient of the third member.

3. The joined body according to claim 1 ,
wherein the second joining layer is thicker than the first joining layer.

4. The joined body according to claim 1 ,
wherein the porosity of the first joining layer is greater than or equal to 5 volume % and less than or equal to 30 volume %, and the porosity of the second joining layer is greater than or equal to 20 volume % and less than or equal to 40 volume %.

5. An electronic device comprising:
the joined body according to claim 1 ,
wherein the first member is a semiconductor light emitting element, an electric circuit, or a power semiconductor element.

6. An electronic device comprising:
the joined body according to claim 2 ,
wherein the first member is a semiconductor light emitting element, an electric circuit, or a power semiconductor element.

7. An electronic device comprising:
the joined body according to claim 3 ,
wherein the first member is a semiconductor light emitting element, an electric circuit, or a power semiconductor element.

8. An electronic device comprising:
the joined body according to claim 4 ,
wherein the first member is a semiconductor light emitting element, an electric circuit, or a power semiconductor element.

9. A projector comprising:
a light emitting device including the joined body according to claim 1 , in which the first member is a semiconductor light emitting element;
a light modulating unit which modulates light exiting from the light emitting device according to image information; and
a projecting unit which projects an image formed by the light modulating unit.

10. A projector comprising:
a light emitting device including the joined body according to claim 2 , in which the first member is a semiconductor light emitting element;
a light modulating unit which modulates light exiting from the light emitting device according to image information; and
a projecting unit which projects an image formed by the light modulating unit.

11. A projector comprising:
a light emitting device including the joined body according to claim 3 , in which the first member is a semiconductor light emitting element;
a light modulating unit which modulates light exiting from the light emitting device according to image information; and
a projecting unit which projects an image formed by the light modulating unit.

12. A projector comprising:
a light emitting device including the joined body according to claim 4 , in which the first member is a semiconductor light emitting element;
a light modulating unit which modulates light exiting from the light emitting device according to image information; and
a projecting unit which projects an image formed by the light modulating unit.

13. A manufacturing method of a joined body comprising:
a first calcining step of arranging a first metal paste containing metal particles between a first member, which is an exothermic body, and a second member, and of calcining the first metal paste by heating; and
a second calcining step of arranging a second metal paste containing metal particles between the second member and the third member, and of simultaneously calcining the first metal paste and the second metal paste by heating,
wherein a porosity of a sintered body of the first metal paste is lower than a porosity of a sintered body of the second metal paste.

14. The manufacturing method of a joined body according to claim 13 ,
wherein a calcining temperature of the second calcining step is lower than a calcining temperature of the first calcining step.

15. The manufacturing method of a joined body according to claim 13 ,
wherein a calcining time of the second calcining step is shorter than a calcining time of the first calcining step.

Assignees

• Seiko Epson Corp

Inventors

• Miyasaka Hideo

Classifications

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W40/22

  characterised by their shape, e.g. having conical or cylindrical projections · CPC title

• H10W72/013

  of die-attach connectors · CPC title

• H10W72/352

  comprising metals or metalloids, e.g. solders · CPC title

• H10W72/367

  Multiple die-attach connectors having different functions · CPC title