Deposition mask for forming thin-film patterns

Patent metadata

Field	Value
Publication number	US-10035162-B2
Application number	US-201314439309-A
Country	US
Kind code	B2
Filing date	Jul 18, 2013
Priority date	Oct 30, 2012
Publication date	Jul 31, 2018
Grant date	Jul 31, 2018

Abstract

The present invention provides a deposition mask for forming a thin-pattern by depositing a deposition material on a substrate, the deposition mask includes: a thin plate-shaped magnetic metal member 1 in which a through-hole 4 having shape and dimensions greater than those of the thin-film pattern is provided at a position corresponding to the thin-film pattern; and a resin film 2 which is provided in close contact with one surface of the magnetic metal member 1 and in which an opening pattern 5 having shape and dimensions identical to those of the thin-film pattern is formed at a position corresponding to the thin-film pattern in the through-hole 4 , the resin film 2 being permeable to visible light. The opening pattern 5 is provided within an opening pattern formation region 7 surrounded by a deposition shadow region 6 defined by the thickness of the magnetic metal member 1 and the maximum angle of incidence of the deposition material to the film surface in the through-hole 4.

First claim

What is claimed is:

1. A deposition mask for forming a plurality of thin-film patterns by depositing material on a substrate, the plurality of thin-film patterns having a fixed array pitch in an arrangement direction, the deposition mask comprising:
a magnetic metal member which is a plate that has through-holes arranged at a fixed array pitch in the arrangement direction, where the fixed array pitch of the through-holes of magnet metal member is set to the fixed array pitch of the plurality of the thin-film patterns; each of said through-holes having shaped and dimensions greater in the arrangement direction than those of a corresponding one of the thin-film patterns in the arrangement direction; and
a resin film which is permeable to visible light and provided in contact with one surface of the magnetic metal member, the resin film having opening pattern, each of the opening patterns which has shape and dimensions identical to those of a corresponding one of the thin-film patterns and is formed at a position corresponding to one of the thin-film patterns in the through-hole by laser-processing the resin film through one of the through-holes of the magnetic metal member,
wherein one of the opening patterns is provided within an opening pattern formation region surrounded by a deposition shadow region that is defined in the arrangement direction by the thickness of the magnetic metal member and a maximum angle of incidence of the deposition material to a surface of the resin film in the through-hole, wherein the width of the deposition shadow region in the arrangement direction is t×tan θ where t represents the thickness of the magnetic metal member, and θ represents the maximum angle of incidence of the deposition material to a normal line of the surface of the resin film; where the deposition shadow region included a portion of the resin film in the arrangement direction located between an end of the width of an area of the resin film between adjacent through-holes and a tolerance value α of positional deviation,
where said tolerance value α of positional deviation refers to a width of an area in the arrangement direction located between the deposition shadow region and the opening pattern;
wherein the width W 1 of the opening pattern formation region in the same direction as an arrangement direction of the through-holes is equal to a first value, W 2 +2α, obtained by adding a second value 2α that is twice as large as the tolerance value α of positional deviation of the opening pattern in the same direction as the arrangement direction of the through-holes, to at least the width W 2 of the opening pattern in the same direction, where the opening pattern formation region comprises a region including one of the opening patterns and a portion of the resin film on both sides of the opening pattern including the tolerance value of the positional deviation located between the opening pattern and the deposition shadow region of the resin film on each side of the opening pattern, the positional deviation occurring while opening pattern is formed.

2. The deposition mask according to claim 1 , wherein the width in the arrangement direction of the through-holes is equal to a third value W 1 +2×t×tan θ obtained by adding a fourth value 2×t×tan θ that is twice as large as the width t×tan θ of the deposition shadow region in the same direction as the arrangement direction of the through-holes, to the width W 1 of the opening pattern formation region in the same direction as the arrangement direction of the through-holes.

3. The deposition mask according to claim 1 , wherein the magnetic metal member is made of nickel, a nickel alloy, Invar, or an Invar alloy.

4. The deposition mask according to claim 1 , wherein the resin film is made of polyimide.

5. The deposition mask according to claim 1 , wherein one end surface of a frame provided with an opening sized to include the through-hole is bonded to a peripheral edge region of one surface of the magnetic metal member.

Assignees

• V Tech Co Ltd

Inventors

• Mizumura Michinobu

Classifications

• H10P76/405

  characterised by their composition, e.g. multilayer masks · CPC title

• H01L51/001

  Electricity · mapped topic

• B05C21/005

  Masking devices (stencils B05C17/06; masking devices for which the means for applying liquids or other fluent material is spraying or is not important B05B12/20) · CPC title

• H01L21/0332

  Electricity · mapped topic

• B05D1/32

  using means for protecting parts of a surface not to be coated, e.g. using stencils, resists · CPC title