Method for recycling of obsolete printed circuit boards

Patent metadata

Field	Value
Publication number	US-10034387-B2
Application number	US-201514962250-A
Country	US
Kind code	B2
Filing date	Dec 8, 2015
Priority date	Apr 15, 2010
Publication date	Jul 24, 2018
Grant date	Jul 24, 2018

Abstract

Processes for recycling printed wire boards using environmentally-friendly compositions, wherein electronic components, precious metals and base metals may be collected for reuse and recycling.

First claim

What is claimed is:

1. A method of removing at least one base metal from a printed wire board (PWB), said method comprising:
(a) contacting a surface of the PWB with a base metal removal composition, wherein the PWB and the base metal removal composition are in a vessel;
(b) agitating said vessel;
(c) dissolving or solubilizing the base metal in the base metal removal composition;
(d) removing the base metal removal composition from the PWB by rinsing;
(e) drying the PWB.

2. The process of claim 1 , wherein the at least one base metal comprises a metal selected from the group consisting of nickel, zinc, copper, aluminum, tungsten, molybdenum, tantalum, magnesium, cobalt, bismuth, cadmium, titanium, zirconium, antimony, manganese, beryllium, chromium, germanium, vanadium, gallium, hafnium, indium, niobium, rhenium, thallium, alloys comprising same, and combinations thereof.

3. The process of claim 1 , wherein the base metal removal composition comprises at least one oxidizing agent, optionally at least one base metal complexing agent, optionally at least one organic solvent, and optionally at least one passivating agent for passivating precious metals.

4. The process of claim 3 , wherein the at least one oxidizing agent comprises nitric acid, ozone, bubbled air, cyclohexylaminosulfonic acid, hydrogen peroxide, oxone, ammonium peroxomonosulfate, ammonium chlorite, ammonium chlorate, ammonium iodate, ammonium perborate, ammonium perchlorate, ammonium periodate, ammonium persulfate, ammonium hypochlorite, sodium persulfate, sodium hypochlorite, potassium iodate, potassium permanganate, potassium persulfate, potassium persulfate, potassium hypochlorite, tetramethylammonium chlorite, tetramethylammonium chlorate, tetramethylammonium iodate, tetramethylammonium perborate, tetramethylammonium perchlorate, tetramethylammonium periodate, tetramethylammonium persulfate, tetrabutylammonium peroxomonosulfate, peroxomonosulfuric acid, urea hydrogen peroxide, peracetic acid, sodium nitrate, potassium nitrate, ammonium nitrate, methanesulfonic acid (MSA), ethanesulfonic acid, 2-hydroxyethanesulfonic acid, n-propanesulfonic acid, isopropanesulfonic acid, isobutenesulfonic acid, n-butanesulfonic acid, n-octanesulfonic acid), benzenesulfonic acid, benzenesulfonic acid derivatives (e.g., 4-methoxybenzenesulfonic acid, 4-hydroxybenzenesulfonic acid, 4-aminobenzenesulfonic acid, 4-nitrobenzenesulfonic acid, toluenesulfonic acid, hexylbenzenesulfonic acid, heptylbenzenesulfonic acid, octylbenzenesulfonic acid, nonylbenzenesulfonic acid, decylbenzenesulfonic acid, undecylbenzenesulfonic acid, dodecylbenzenesulfonic acid, tridecylbenzenesulfonic acid, tetradecylbenzene sulfonic acid, hexadecylbenzene sulfonic acid, 3-nitrobenzenesulfonic acid, 2-nitrobenzenesulfonic acid, 2-nitronaphthalenesulfonic acid, 3-nitronaphthalenesulfonic acid, 2,3-dinitrobenzenesulfonic acid, 2,4-dinitrobenzenesulfonic acid, 2,5-dinitrobenzenesulfonic acid, 2,6-dinitrobenzenesulfonic acid, 3,5-dinitrobenzenesulfonic acid, 2,4,6-trinitrobenzenesulfonic acid, 3-aminobenzenesulfonic acid, 2-aminobenzenesulfonic acid, 2-aminonaphthalenesulfonic acid, 3-aminonaphthalenesulfonic acid, 2,3-diaminobenzenesulfonic acid, 2,4-diaminobenzenesulfonic acid, 2,5-diaminobenzenesulfonic acid, 2,6-diaminobenzenesulfonic acid, 3,5-diaminobenzenesulfonic acid, 2,4,6-triaminobenzenesulfonic acid, 3-hydroxybenzenesulfonic acid, 2-hydroxybenzenesulfonic acid, 2-hydroxynaphthalenesulfonic acid, 3-hydroxynaphthalenesulfonic acid, 2,3-dihydroxybenzenesulfonic acid, 2,4-dihydroxybenzenesulfonic acid, 2,5-dihydroxybenzenesulfonic acid, 2,6-dihydroxybenzenesulfonic acid, 3,5-dihydroxybenzenesulfonic acid, 2,3,4-trihydroxybenzenesulfonic acid, 2,3,5-trihydroxybenzenesulfonic acid, 2,3,6-trihydroxybenzenesulfonic acid, 2,4,5-trihydroxybenzenesulfonic acid, 2,4,6-trihydroxybenzenesulfonic acid, 3,4,5-trihydroxybenzenesulfonic acid, 2,3,4,5-tetrahydroxybenzenesulfonic acid, 2,3,4,6-tetrahydroxybenzenesulfonic acid, 2,3,5,6-tetrahydroxybenzenesulfonic acid, 2,4,5,6-tetrahydroxybenzenesulfonic acid, 3-methoxybenzenesulfonic acid, 2-methoxybenzenesulfonic acid, 2,3-dimethoxybenzenesulfonic acid, 2,4-dimethoxybenzenesulfonic acid, 2,5-dimethoxybenzenesulfonic acid, 2,6-dimethoxybenzenesulfonic acid, 3,5-dimethoxybenzenesulfonic acid, 2,4,6-trimethoxybenzenesulfonic acid, and combinations thereof.

5. The process of claim 3 , comprising the at least one base metal complexing agent, wherein the at least one complexing agent comprises a species selected from the group consisting of ammonium chloride, sodium chloride, lithium chloride, potassium chloride, ammonium sulfate, hydrochloric acid, sulfuric acid, and combinations thereof.

6. The process of claim 4 , comprising the at least one base metal complexing agent, wherein the at least one complexing agent comprises a species selected from the group consisting of ammonium chloride, sodium chloride, lithium chloride, potassium chloride, ammonium sulfate, hydrochloric acid, sulfuric acid, and combinations thereof.

7. The process of claim 1 , wherein at least one precious metal is recovered from the PWB by contacting the PWB with the base metal removal composition, thereby undercutting the at least one precious metal from the PWB.

8. The process of claim 7 , wherein the at least one precious metal comprises gold and the PWB comprises a gold finger which is undercut using the base metal removal composition.

9. The process of claim 1 , wherein the base metal removal composition selectively dissolves at least one base metal relative to precious metals.

10. The process of claim 9 , wherein the precious metals comprise at least one species selected from the group consisting of gold, silver, platinum, palladium, and alloys comprising same.

11. The process of claim 1 , further comprising releasing at least one PWB component from the PWB prior to contacting the surface of the PWB with a base metal removal composition.

12. The process of claim 11 , wherein the at least one PWB component comprises a species selected from the group consisting of transistors, capacitors, resistors, heat sinks, integrated circuits, integrated switches, processors, chips, and combinations thereof.

13. The process of claim 11 , wherein the at least one PWB component is released from a batch of PWBs during dissolution or solubilization of solder using a solder removal composition, wherein the solder removal composition selectively removes solder relative to precious metals and base metals.

14. The process of claim 13 , wherein the solder comprises lead, tin or a lead/tin alloy.

15. The process of claim 13 , wherein the solder removal composition comprises at least one oxidizing agent, and at least one passivating agent for passivating precious metals.

16. The process of claim 15 , wherein the at least one oxidizing agent comprises nitric acid, ozone, bubbled air, cyclohexylaminosulfonic acid, hydrogen peroxide, oxone, ammonium peroxomonosulfate, ammonium chlorite, ammonium chlorate, ammonium iodate, ammonium perborate, ammonium perchlorate, ammonium periodate, ammonium persulfate, ammonium hypochlorite, sodium persulfate, sodium hypochlorite, potassium iodate, potassium permanganate, potassium persulfate, potassium persulfate, potassium hypochlorite, tetramethylammonium chlorite, tetramethylammonium chlorate, tetramethylammonium iodate, tetramethylammonium perborate, tetramethylammonium perchlorate, tetramethylammonium periodate, tetramethylammonium persulfate, tetrabutylammonium peroxomonosulfate, peroxomonosulfuric acid, urea hydrogen peroxide, peracetic acid, sodium nitrate, potassium n

Assignees

• Entegris Inc

Inventors

• BROSSEAU André
• Grigorenko Svitlana
• Jiang Ping
• Korzenski Michael B

Classifications

• C22B11/046

  from manufactured products, e.g. from printed circuit boards, from photographic films, paper or baths · CPC title

• C23F1/44

  Compositions for etching metallic material from a metallic material substrate of different composition · CPC title

• Y02P10/214

  Cross-Sectional Technologies · mapped topic

• Y02P70/613

  Cross-Sectional Technologies · mapped topic

• Y10T29/49815

  Disassembling · CPC title