Method of manufacturing an alectronic circuit

Patent metadata

Field	Value
Publication number	US-10034364-B2
Application number	US-201615134526-A
Country	US
Kind code	B2
Filing date	Apr 21, 2016
Priority date	Nov 11, 2010
Publication date	Jul 24, 2018
Grant date	Jul 24, 2018

Abstract

An electronic circuit of the present invention includes: a circuit board on which an electronic component is mounted; a heat conducting sheet stacked on the electronic component; and a heat sink stacked on the heat conducting sheet. The heat sink includes a porous ceramics having a volume resistivity of 1010 Ohm·cm or more and a porosity of 15-50 vol %.

First claim

The invention claimed is:

1. A method of manufacturing an electronic circuit comprising:
a circuit board on which an electronic component is mounted;
a heat conducting sheet stacked on the electronic component; and
a heat sink stacked on the heat conducting sheet,
wherein the heat sink comprises a porous ceramics having a volume resistivity of 10 10 Ohm·cm or more and a porosity of 15-50 vol%, the method comprising:
mixing at least silica dioxide, alumina and silicon carbide to produce granulated particles having a particle diameter of 10-1250 μm; and
sintering the produced granulated particles at a temperature of 1,000-1,400° C., the silica dioxide and the alumina each having an average particle diameter of 1-10 μm and the silicon carbide having an average particle diameter of 10-150 μm.

2. The method of manufacturing the electronic circuit according to claim 1 , wherein the porous ceramics includes 60-85 weight % of the silicon carbide and at least 10 weight % or more of the silica dioxide.

3. A method of manufacturing a heat sink comprising:
a porous ceramics having a volume resistivity of 10 10 Ohm·cm or more and a porosity of 15-50 vol%, the method comprising:
mixing at least silica dioxide, alumina and silicon carbide to produce granulated particles having a particle diameter of 10-1250 μm; and
sintering the produced granulated particles at a temperature of 1,000-1,400° C., the silica dioxide and the alumina each having an average particle diameter of 1-10 μm and the silicon carbide having an average particle diameter of 10-150 μm.

4. The method of manufacturing the heat sink according to claim 3 , wherein the porous ceramics includes 60-85 weight % of the silicon carbide and at least 10 weight % or more of the silica dioxide.

Assignees

• Kitagawa Ind Co Ltd
• Tyk Corp

Inventors

• Kawaguchi Yasuhiro
• Kubo Masataka

Classifications

• H10W40/257 Primary

  having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures (H10W40/254, H10W40/251 take precedence) · CPC title

• F28F21/04

  of ceramic; of concrete; of natural stone · CPC title

• H05K1/0203 Primary

  Cooling of mounted components (H05K1/0272 takes precedence) · CPC title

• F28F13/003

  by using permeable mass, perforated or porous materials (F28F13/18 takes precedence) · CPC title

• H01L23/3733

  Electricity · mapped topic