Flexible organic light emitting diode display device and method of fabricating the same

Patent metadata

Field	Value
Publication number	US-10026926-B2
Application number	US-201514935277-A
Country	US
Kind code	B2
Filing date	Nov 6, 2015
Priority date	Jun 30, 2015
Publication date	Jul 17, 2018
Grant date	Jul 17, 2018

Abstract

Embodiments relate to a method of forming an organic light emitting diode (OLED) display device. A first inorganic layer, a first organic layer, and a second inorganic layer are formed on pixel regions of an OLED display device. At least part of a first inorganic layer is formed using atomic layer deposition (ALD), such that the first inorganic layer completely covers particles generated on the OLED. Embodiments also relate to an OLED display device with pixel regions, each pixel region including an OLED, a bank layer across a boundary between adjacent pixel regions, and a first inorganic layer on at least a portion of the OLED and the bank layer. The first inorganic layer includes a first inorganic sub-layer and a second inorganic sub-layer.

First claim

What is claimed is:

1. A method of forming an organic light emitting diode (OLED) display device, comprising:
forming a plurality of pixel regions on a display area of a flexible substrate, each of the pixel regions including an OLED;
forming at least part of a first inorganic layer on the plurality of pixel regions using atomic layer deposition (ALD) or plasma-enhanced chemical vapor deposition (PECVD);
forming a first organic layer over the entire first inorganic layer;
forming a second inorganic layer using PECVD on the first organic layer;
forming a second organic layer on the second inorganic layer; and
attaching a barrier film on the second organic layer using an adhesion layer between the second organic layer and the barrier film,
wherein a modulus value of the second organic layer is larger than a modulus value of the adhesion layer and smaller than a modulus value the first organic layer and a modulus value of the second inorganic layer.

2. The method of claim 1 , wherein the entire first inorganic layer is formed using ALD.

3. The method of claim 1 , wherein forming at least part of the first inorganic layer comprises:
forming a first inorganic sub-layer of the first inorganic layer using ALD; and
forming a second inorganic sub-layer of the first inorganic layer using PECVD.

4. The method of claim 3 , wherein the second inorganic sub-layer is formed on the first inorganic sub-layer.

5. The method of claim 3 , wherein the first inorganic sub-layer is formed on the second inorganic sub-layer.

6. The method of claim 3 , wherein a thickness of the first inorganic sub-layer is 0.01 to 0.1 micrometers.

7. The method of claim 3 , wherein a thickness of the second inorganic sub-layer and the second inorganic layer is 0.1 to 2 micrometers.

8. The method of claim 1 , wherein a thickness of the first organic layer is larger than a thickness of the second organic layer, the first organic layer formed of acryl-based compounds and the second organic layer formed of epoxy-based compounds.

9. The method of claim 1 , wherein the second organic layer is over the entire second inorganic layer.

Assignees

• Lg Display Co Ltd

Inventors

• Lee Jae-Young
• Kim Ji-Min
• KIM Gi-Youn
• Oh Sang-Hoon

Classifications

• H01L51/5256 Primary

  Electricity · mapped topic

• H01L27/3244

  Electricity · mapped topic

• H01L2251/5338

  Electricity · mapped topic

• H10K59/8731

  multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers · CPC title

• H10K50/8445

  multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers · CPC title