Organic light emitting diode display and method for manufacturing organic light emitting diode display

Patent metadata

Field	Value
Publication number	US-2017222176-A1
Application number	US-201715410392-A
Country	US
Kind code	A1
Filing date	Jan 19, 2017
Priority date	Feb 1, 2016
Publication date	Aug 3, 2017
Grant date	—

Abstract

An organic light emitting device includes a substrate. An organic light emitting diode is disposed on the substrate. A thin film encapsulation layer is disposed over the organic light emitting diode. The thin film encapsulation layer includes at least one organic layer. An organic passivation layer is disposed directly on the thin film encapsulation layer. The organic passivation layer has a smaller Young's modulus than the organic layer of the thin film encapsulation layer.

First claim

What is claimed is:

1 . An organic light emitting device comprising:
a substrate; an organic light emitting diode disposed on the substrate; a thin film encapsulation layer disposed over the organic light emitting diode, the thin film encapsulation layer including at least one organic layer; and an organic passivation layer disposed directly on the thin film encapsulation layer, wherein the organic passivation layer has a smaller Young's modulus than the organic layer of the thin film encapsulation layer.

2 . The organic light emitting device of claim 1 , wherein
the organic passivation layer is thicker than the thin film encapsulation layer.

3 . The organic light emitting device of claim 1 , wherein
the organic passivation layer is thicker than the organic layer.

4 . The organic light emitting device of claim 1 , wherein
the organic passivation layer includes an organic material that is different from the at least one organic material of the organic layer.

5 . The organic light emitting device of claim 4 , wherein
the organic passivation layer includes at least one of poly-para-xylylene, polyvinylidene fluoride, polymethylsiloxane, polybutadiene, polymethyl methacrylate, polyacrolein, and polydivinylbenzene.

6 . The organic light emitting device of claim 1 , wherein
the thin film encapsulation layer further includes at least one inorganic layer disposed on the organic light emitting diode.

7 . The organic light emitting device of claim 6 , wherein
The inorganic layer is disposed on an uppermost layer of the thin film encapsulation layer, and the organic passivation layer directly contacts the inorganic layer.

8 . The organic light emitting device of claim 6 , wherein
the inorganic layer is disposed in plural, and the organic layer is disposed between neighboring inorganic layers from among the plurality of inorganic layers.

9 . The organic light emitting device of claim 1 , wherein
the organic passivation layer is deposited on a surface of the thin film encapsulation layer.

10 . The organic light emitting device of claim 1 , wherein
no adhesive layer is disposed between the thin film encapsulation layer and the organic passivation layer.

11 . The organic light emitting device of claim 1 , wherein
the substrate is flexible.

12 . A method for manufacturing an organic light emitting device, comprising:
disposing an organic light emitting diode on a substrate; disposing a thin film encapsulation layer over the organic light emitting diode and the substrate; and depositing an organic passivation layer, having a smaller Young's modulus than that of the thin film encapsulation layer, on a surface of the thin film encapsulation layer.

13 . The method of claim 12 , wherein
the depositing of the organic passivation layer is performed by a chemical vapor deposition (CVD) process.

14 . The method of claim 12 , wherein
the disposing of the thin film encapsulation layer and the disposing of the organic passivation layer are performed in a same chamber.

15 . An organic light emitting device, comprising:
a flexible substrate; a thin film encapsulation layer disposed on the flexible substrate; an organic light emitting diode encapsulated between the thin film encapsulation layer and the flexible substrate; and an organic passivation layer disposed over the thin film encapsulation layer, wherein the thin film encapsulation layer is more elastic than the organic passivation layer.

16 . The organic light emitting device of claim 15 , wherein the thin film encapsulation layer includes an organic layer and the organic layer of the thin film encapsulation layer is more elastic than the organic passivation layer.

17 . The organic light emitting device of claim 16 , wherein the organic passivation layer is thicker than the organic layer.

18 . The organic light emitting device of claim 16 , wherein the organic passivation layer includes an organic material that is different from the organic layer.

19 . The organic light emitting device of claim 15 , wherein there is no adhesive layer disposed between the organic passivation layer and the thin film encapsulation layer.

20 . The organic light emitting device of claim 15 , wherein the organic passivation layer is thicker than the thin film encapsulation layer.

Assignees

• Samsung Display Co Ltd

Inventors

• Hayk Khachatryan
• Kim Ki Hyun
• Kim Sun Ho
• Kim Jeong Ho
• Kim Tae Woong
• Choi Dan Bi

Classifications

• H10W74/47

  comprising organic materials, e.g. plastics or resins · CPC title

• H10W74/01

  Manufacture or treatment · CPC title

• H01L51/56

  Electricity · mapped topic

• H01L51/0097

  Electricity · mapped topic

• H01L51/5237 Primary

  Electricity · mapped topic