Semiconductor device and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-10026715-B2
Application number	US-201615064971-A
Country	US
Kind code	B2
Filing date	Mar 9, 2016
Priority date	Mar 17, 2015
Publication date	Jul 17, 2018
Grant date	Jul 17, 2018

Abstract

A semiconductor device according to the present embodiment includes a semiconductor substrate, an insulating film and a conductive film. The insulating film is disposed on a first surface of the semiconductor substrate. The insulating film covers a semiconductor element. The conductive film penetrates the semiconductor substrate across from the first surface to a second surface opposite to the first surface. On the second surface, a trench continuously or intermittently exists across from a first end part side of the second surface to a second end part side thereof.

First claim

The invention claimed is:

1. A semiconductor device comprising:
a semiconductor substrate;
an insulating film disposed on a first surface of the semiconductor substrate, the insulating film covering a semiconductor element; and
a conductive film penetrating the semiconductor substrate across from the first surface to a second surface opposite to the first surface,
a trench across from a first end part side of the second surface to a second end part side thereof.

2. The semiconductor device according to claim 1 , wherein the trench exists in a continuous grid shape.

3. The semiconductor device according to claim 1 , wherein
a plurality of the trenches exist intermittently, and
at least one of the plurality of trenches exists in a cross shape.

4. The semiconductor device according to claim 1 , wherein the trench exists over a whole surface of the second surface.

5. The semiconductor device according to claim 1 , wherein at least part of the trench penetrates the semiconductor substrate across from the first surface to the second surface.

6. The semiconductor device according to claim 1 , wherein the trench contains a bottomed groove.

7. The semiconductor device according to claim 1 , comprising a reinforcing film disposed inside the trench.

8. The semiconductor device according to claim 1 , comprising
a plurality of the semiconductor substrates facing one another, wherein
the conductive films are arranged in the plurality of semiconductor substrates so as to oppose each other,
the semiconductor device comprising a joint between the conductive films that oppose each other.

9. The semiconductor device according to claim 7 , wherein the reinforcing film comprises Ti, TiN, W, Al, Ni, Cu, SiO2, SiN or SiON.

10. The semiconductor device according to claim 8 , wherein the semiconductor substrate is a silicon substrate.

11. The semiconductor device according to claim 1 , wherein the conductive film is a Through-Silicon Via.

12. The semiconductor device according to claim 1 , wherein the conductive film is supplied inside a through hole, the through hole being formed on the substrate.

13. The semiconductor device according to claim 1 , wherein the conductive film comprises Ni.

14. The semiconductor device according to claim 1 , wherein the conductive film is electrically connected to the semiconductor element.

15. The semiconductor device according to claim 1 , further comprising:
a bump on the semiconductor element, and
wherein the conductive film is electrically connected to the semiconductor element on a first side of the semiconductor element, and a bump is electrically connected to the semiconductor element on a second side opposite to the first side of the semiconductor element.

Assignees

• Toshiba Memory Corp

Inventors

• Kume Ippei
• Higashi Kazuyuki

Classifications

• H10W90/722

  between stacked chips · CPC title

• H10W90/297

  characterised by the through-semiconductor vias [TSVs] in the stacked chips · CPC title

• H10W74/142

  the encapsulations exposing the passive side of the semiconductor body · CPC title

• H10W74/117

  the substrate having spherical bumps for external connection · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title