Adhesive bonding composition and wafer-to-wafer bonded assembly prepared from the same

Patent metadata

Field	Value
Publication number	US-10026711-B2
Application number	US-201615382835-A
Country	US
Kind code	B2
Filing date	Dec 19, 2016
Priority date	May 6, 2010
Publication date	Jul 17, 2018
Grant date	Jul 17, 2018

Abstract

A polymerizable composition includes at least one monomer, a photoinitiator capable of initiating polymerization of the monomer when exposed to light, and a phosphor capable of producing light when exposed to radiation (typically X-rays). The material is particularly suitable for bonding components at ambient temperature in situations where the bond joint is not accessible to an external light source. An associated method includes: placing a polymerizable adhesive composition, including a photoinitiator and energy converting material, such as a down-converting phosphor, in contact with at least two components to be bonded to form an assembly; and, irradiating the assembly with radiation at a first wavelength, capable of conversion (down-conversion by the phosphor) to a second wavelength capable of activating the photoinitiator, to prepare items such as inkjet cartridges, wafer-to-wafer assemblies, semiconductors, integrated circuits, and the like.

First claim

The invention claimed is:

1. A wafer to wafer bonded assembly, comprising a plurality of semiconductor wafers bonded together by a cured adhesive composition obtained by curing of a curable adhesive composition, wherein the curable adhesive composition comprises an organic vehicle comprising at least one polymerizable monomer; at least one photo-initiator responsive to a selected wavelength of light; and at least one energy converting material selected to emit said wavelength of light when exposed to a selected imparted radiation,
wherein (1) the viscosity of said organic vehicle is suitable for dispensing through an automated dispenser onto a selected substrate, (2) the viscosity of said organic vehicle is suitable for printing onto a selected substrate through a mask, or (3) wherein said adhesive is photo-patternable.

2. The assembly of claim 1 , wherein the at least one energy converting material is an upconverting material.

3. The assembly of claim 2 , wherein the imparted radiation is near infrared.

4. The assembly of claim 1 , wherein the at least one energy converting material is a downconverting material.

5. The assembly of claim 4 , wherein the imparted radiation is an ionizing radiation.

6. The assembly of claim 5 , wherein the ionizing radiation is X-rays.

7. The assembly of claim 1 wherein said organic vehicle comprises a monomer forming a thermoset resin.

8. The assembly of claim 7 , wherein said thermoset resin is selected from the group consisting of: acrylics, phenolics, urethanes, epoxies, styrenes, and silicones.

9. The assembly of claim 1 , wherein said at least one photoinitiator is selected from the group consisting of: benzoin ethers, benzil ketals, α-dialkoxyacetophenones, α-aminoalkylphenones, acylphosphine oxides, benzophenones/amines, thioxanthones/amines, and titanocenes.

10. The assembly of claim 4 , wherein said wavelength of light is in the UV range and said ionizing radiation comprises X-rays.

11. The assembly of claim 4 , wherein said downconverting material comprises dispersed inorganic particulates selected from the group consisting of: metal oxides; metal sulfides; doped metal oxides; and mixed metal chalcogenides.

12. The assembly of claim 1 , wherein the viscosity of said organic vehicle is suitable for dispensing through an automated dispenser onto a selected substrate.

13. The assembly of claim 1 , wherein the viscosity of said organic vehicle is suitable for printing onto a selected substrate through a mask.

14. The assembly of claim 1 , wherein said adhesive is photo-patternable.

15. The assembly of claim 1 , further comprising inorganic particulates selected from the group consisting of: metals and metal alloys, ceramics and dielectrics, and metal-coated polymers.

16. The assembly of claim 1 , further comprising an organic component selected from the group consisting of: solvents, viscosity modifiers, surfactants, dispersants, and plasticizers.

17. The assembly of claim 1 , further comprising a sheet containing a monolayer of conductive particles of a suitable size to render the resulting adhesive bond anisotropically conductive.

18. The assembly of claim 1 , wherein the at least one photo-initiator and the at least one energy converting material are chemically tethered to one another.

19. An electrically conductive resin or adhesive composition comprising:
an organic vehicle comprising at least one polymerizable monomer;
at least one photo-initiator responsive to a selected wavelength of light;
at least one energy converting material selected to emit said wavelength of light when exposed to a selected imparted radiation, and
wherein the at least one energy converting material comprises an isotropically or anisotropically conductive polymer particle, or the composition further comprises at least one electrically conductive additive, or both.

20. The electrically conductive resin or adhesive composition of claim 19 , wherein the composition comprises the at least one electrically conductive additive.

21. The electrically conductive resin or adhesive composition of claim 20 , wherein the at least one electrically conductive additive is an electrically conductive organic additive.

22. The electrically conductive resin or adhesive composition of claim 20 , wherein the at least one electrically conductive additive is an electrically conductive inorganic additive.

23. The electrically conductive resin or adhesive composition of claim 20 , wherein the at least one electrically conductive additive is an isotropically or anisotropically conductive polymer particle.

24. The electrically conductive resin or adhesive composition of claim 23 , wherein the at least one electrically conductive additive is an isotropically conductive polymer particle.

25. The electrically conductive resin or adhesive composition of claim 23 , wherein the at least one electrically conductive additive is an anisotropically conductive polymer particle.

26. The electrically conductive resin or adhesive composition of claim 24 , wherein the composition is isotropically conductive.

27. The electrically conductive resin or adhesive composition of claim 25 , wherein the composition is anisotropically conductive.

28. The electrically conductive resin or adhesive composition of claim 21 , wherein the electrically conductive organic additive is an electrically conductive form of carbon.

29. The electrically conductive resin or adhesive composition of claim 22 , wherein the electrically conductive inorganic additive is a member selected from the group consisting of metal particles and metal oxide particles.

30. The electrically conductive resin or adhesive composition of claim 29 , wherein the electrically conductive inorganic additive is finely divided metal particles.

31. The electrically conductive resin or adhesive composition of claim 30 , wherein the finely divided metal particles are a member selected from the group consisting of gold, silver, nickel, copper, and alloys thereof.

32. The electrically conductive resin or adhesive composition of claim 19 , wherein the at least one energy converting material comprises an isotropically or anisotropically conductive polymer particle.

33. The electrically conductive resin or adhesive composition of claim 32 , wherein the at least one energy converting material comprises an isotropically conductive polymer particle.

34. The electrically conductive resin or adhesive composition of claim 32 , wherein the at least one energy converting material comprises an anisotropically conductive polymer particle.

35. The electrically conductive resin or adhesive composition of claim 33 , wherein the composition is isotropically conductive.

36. The electrically conductive resin or adhesive composition of claim 34 , wherein the composition is anisotropically conductive.

37. The electrically conductive resin or adhesive composition of claim 19 , wherein the viscosity of said organic vehicle is suitable for dispensing through an automated dispenser onto a selected substrate.

38. The electrically conductive resin or adhesive composition of claim 19 , wherein the viscosity of said organic vehicle is suitable for printing onto a selecte

Assignees

• Immunolight Llc

Inventors

• Fathi Zakaryae
• Clayton James
• Walder Harold
• Bourke Jr Frederic A

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/288

  characterised by arrangements for thermal management of the stacked chips · CPC title

• H10W90/20

  Configurations of stacked chips · CPC title