High-frequency wire and high-frequency coil

US10026526B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10026526-B2
Application numberUS-201415024302-A
CountryUS
Kind codeB2
Filing dateSep 22, 2014
Priority dateSep 25, 2013
Publication dateJul 17, 2018
Grant dateJul 17, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A high-frequency wire includes: a central conductor that is formed from aluminum or an aluminum alloy; and a magnetic layer that has a fibrous structure formed along a longitudinal direction of the central conductor and covers the central conductor.

First claim

Opening claim text (preview).

The invention claimed is: 1. A high-frequency wire, comprising: a central conductor that is formed from aluminum or an aluminum alloy; and a soft magnetic layer that has a fibrous structure including a crystal grain and formed along a longitudinal direction of the central conductor and covers the central conductor, the soft magnetic layer being formed from iron or an iron alloy. 2. The high-frequency wire according to claim 1 , wherein the soft magnetic layer includes an insulation coating layer on an outer surface side. 3. A litz wire, comprising: a plurality of the twisted high-frequency wires according to claim 1 . 4. A high-frequency coil, comprising: the high-frequency wire according to claim 1 . 5. A method of manufacturing the high-frequency wire according to claim 1 , comprising drawing a wire base material including a central conductor which is formed from aluminum or an aluminum alloy and a soft magnetic layer which covers the central conductor by using one or a plurality of dies, thereby obtaining the high-frequency wire in which the soft magnetic layer has a fibrous structure, the soft magnetic layer being formed from iron or an iron alloy. 6. The method of manufacturing a high-frequency wire according to claim 5 , wherein a cumulative reduction rate of area when the wire base material is subjected to wire drawing is equal to or greater than 70%. 7. The method of manufacturing a high-frequency wire according to claim 5 , wherein the wire base material is obtained by inserting the central conductor through a tubular soft magnetic layer body made of the soft magnetic layer. 8. The method of manufacturing a high-frequency wire according to claim 5 , wherein the fibrous structure is formed by drawing the wire base material at a temperature lower than the recrystallization temperature of the soft magnetic layer. 9. The high-frequency wire according to claim 1 , wherein the crystal grain has an aspect ratio greater than 5:1. 10. The high-frequency wire according to claim 1 , wherein a cross-sectional area of the soft magnetic layer is equal to or less than 20% with respect to that of the entire high-frequency wire. 11. The high-frequency wire according to claim 1 , wherein the fibrous structure is formed also in the central conductor along a longitudinal direction of the central conductor.

Assignees

Inventors

Classifications

  • Alloys based on aluminium · CPC title

  • Other insulating material · CPC title

  • H01B7/30Primary

    with arrangements for reducing conductor losses when carrying alternating current, e.g. due to skin effect · CPC title

  • Wires (H01F27/2866 takes precedence) · CPC title

  • Details relating to the conductive cores · CPC title

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Frequently asked questions

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What does patent US10026526B2 cover?
A high-frequency wire includes: a central conductor that is formed from aluminum or an aluminum alloy; and a magnetic layer that has a fibrous structure formed along a longitudinal direction of the central conductor and covers the central conductor.
Who is the assignee on this patent?
Fujikura Ltd
What technology area does this patent fall under?
Primary CPC classification H01B7/30. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jul 17 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).