High-frequency wire and coil

US2016307666A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016307666-A1
Application numberUS-201415100765-A
CountryUS
Kind codeA1
Filing dateOct 24, 2014
Priority dateDec 2, 2013
Publication dateOct 20, 2016
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A high-frequency wire includes: a conductor portion which includes an inner layer formed of a material having lower conductivity than copper, and an outer layer which coats the inner layer and is formed of copper. In a frequency range of an AC current for using the high-frequency wire, in a case where a skin thickness δ [m] of a copper wire including a conductor portion formed of pure copper is defined as δ=√(2/ωσμ), a thickness t [m] of the outer layer satisfies 1.1δ<t<2.7δ. Here ω indicates an angular frequency of a current, which is represented by 2πf, μ indicates magnetic permeability [H/m] of the copper wire, σ indicates conductivity [Ω −1 m −1 ] of copper, and f indicates a frequency [Hz].

First claim

Opening claim text (preview).

1 . A high-frequency wire comprising: a conductor portion which comprises an inner layer formed of a material having lower conductivity than copper, and an outer layer which coats the inner layer and is formed of copper, wherein in a frequency range of an AC current for using the high-frequency wire, in a case where a skin thickness δ [m] of a copper wire including a conductor portion formed of pure copper is defined as δ=√(2/ωσμ), a thickness t [m] of the outer layer satisfies 1.1δ<t<2.7δ, here ω indicates an angular frequency of a current, which is represented by 2πf, μ indicates magnetic permeability [H/m] of the copper wire, σ indicates conductivity [Ω −1 m −1 ] of copper, and f indicates a frequency [Hz]. 2 . The high-frequency wire according to claim 1 , wherein the thickness t of the outer layer satisfies 1.3δ<t<2.7δ. 3 . The high-frequency wire according to claim 1 , wherein the thickness t of the outer layer satisfies 2.0δ<t<2.7δ. 4 . The high-frequency wire according to claim 1 , wherein an insulation coating layer is provided on an outer circumferential surface of the conductor portion. 5 . A high-frequency coil comprising: the high-frequency wire according to claim 4 . 6 . A litz wire comprising: a plurality of the twisted high-frequency wires according to claim 4 . 7 . A cable comprising: the litz wire according to claim 6 , which is subjected to insulation coating. 8 . A coil comprising: the litz wire according to claim 6 .

Assignees

Inventors

Classifications

  • Wires (H01F27/2866 takes precedence) · CPC title

  • H01B7/0009Primary

    Details relating to the conductive cores · CPC title

  • Protection against damage caused by external factors, e.g. sheaths or armouring · CPC title

  • Insulation of windings · CPC title

  • H01B7/30Primary

    with arrangements for reducing conductor losses when carrying alternating current, e.g. due to skin effect · CPC title

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What does patent US2016307666A1 cover?
A high-frequency wire includes: a conductor portion which includes an inner layer formed of a material having lower conductivity than copper, and an outer layer which coats the inner layer and is formed of copper. In a frequency range of an AC current for using the high-frequency wire, in a case where a skin thickness δ [m] of a copper wire including a conductor portion formed of pure copper is…
Who is the assignee on this patent?
Fujikura Ltd
What technology area does this patent fall under?
Primary CPC classification H01B7/0009. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu Oct 20 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).