Semiconductor ceramic and semiconductor ceramic element
US-9318684-B2 · Apr 19, 2016 · US
US10024725B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10024725-B2 |
| Application number | US-201314442357-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 27, 2013 |
| Priority date | Nov 12, 2012 |
| Publication date | Jul 17, 2018 |
| Grant date | Jul 17, 2018 |
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Official abstract text for this publication.
The invention relates to a temperature sensor system comprising a first ceramic housing part comprising a sleeve-shaped lower part with a first lower end having a first opening, and a second upper end having a second opening, and an upper part connected to the second upper end. The temperature sensor system further comprises a temperature probe element which is at least partially arranged in the lower part and which has a ceramic sensor element housing, a sensor element arranged in the sensor element housing, and electrical supply lines. The sensor element housing is at least partially arranged in the first opening. The ceramic sensor element housing has a higher thermal conductivity than the first ceramic housing part. Also disclosed is a method for producing a temperature sensor system.
Opening claim text (preview).
The invention claimed is: 1. A temperature sensor system, comprising: a first ceramic housing part comprising a sleeve-shaped first part with a first end having a first opening and a second end having a second opening, wherein the first ceramic housing part is adapted and arranged to protect the sensor system from outside media; and a temperature probe element arranged at least in part in the first part, the temperature probe element comprising a ceramic sensor element housing, a sensor element arranged in the sensor element housing, and electrical feed lines; wherein the sensor element housing is arranged at least in part in the first opening, and wherein the ceramic sensor element housing has a higher thermal conductivity than the first ceramic housing part. 2. The temperature sensor system according to claim 1 , further comprising a second part, wherein the second part comprises recesses in which the electrical feed lines of the temperature probe element are arranged and guided at least in part, and wherein the first part and the second part are formed in one piece. 3. The temperature sensor system according to claim 1 , wherein the first ceramic housing part is an injection-molded part. 4. The temperature sensor system according to claim 1 , wherein the first ceramic housing part comprises mullite, steatite or zirconium oxide. 5. The temperature sensor system according to claim 1 , wherein the ceramic sensor element housing comprises aluminum oxide, aluminum nitride or silicon carbide. 6. The temperature sensor system according to claim 1 , comprising a second ceramic housing part, wherein the second ceramic housing part is connected to the second part of the first ceramic housing part, and wherein the second part comprises an extension with recesses in which the electrical feed lines are arranged and guided at least in part. 7. The temperature sensor system according to claim 1 , wherein the temperature probe element is fixed in the first ceramic housing part by means of a potting material. 8. The temperature sensor system according to claim 1 , wherein the sensor element is an NTC sensor element. 9. The temperature sensor system according to claim 1 , wherein the sensor element has one of the following structures: a perovskite structure comprising elements Y, Ca, Cr, Al, and O, or a spinel structure comprising elements Ni, Co, Mn, and O. 10. The temperature sensor system according to claim 9 , wherein the sensor element has a perovskite structure with a formula (Y 1-x Ca x )(Cr 1-y Al y )O 3 , where x=0.03 to 0.05 and y=0.85. 11. The temperature sensor system according to claim 9 , wherein the sensor element has a spinel structure with a formula Co 3−(x+y) )Ni x Mn y O 4 , with x=1.32 and y=1.32. 12. A method for producing a temperature sensor system, comprising: providing a first ceramic housing part, wherein the first ceramic housing part comprises a sleeve-shaped first part with a first end having a first opening and a second end having a second opening; providing a temperature probe element, the temperature probe element comprising a ceramic sensor element housing, a sensor element arranged in the ceramic sensor element housing, and electrical feed lines, wherein the ceramic sensor element housing comprises a protrusion; arranging the temperature probe element at least in part in the sleeve-shaped first part of the first ceramic housing part in a manner that the protrusion cooperates with an inner surface of the first part at the first end of the first ceramic housing part, and the ceramic sensor element housing is arranged in part in the first opening and in part protrudes out of the first opening; introducing potting material into the first ceramic housing part in a manner that the temperature probe element is encased at least in part in the potting material; arranging part of the electrical feed lines within recesses of a second part of the first ceramic housing part; and connecting the second part of the first ceramic housing part to a second ceramic housing part using a connecting substance. 13. The method according to claim 12 , wherein the potting material and the connecting substance comprise the same material. 14. The method according to claim 12 , wherein the electrical feed lines are connected using hard soldering, crimping or welding to connection lines, wherein the connection lines are arranged partly in the recesses of the second part prior to the connection of the second part to the second ceramic housing part, and wherein the connection lines are sealed by a polymer or glass in an exit region from the first ceramic housing part, the second ceramic housing part, or both. 15. A method for producing a temperature sensor system, comprising: providing a first ceramic housing part comprising a sleeve-shaped first part with a first end having a first opening and a second end having a second opening, wherein the first ceramic housing part is adapted and arranged to protect the sensor system from outside media; and providing a temperature probe element arranged at least in part in the first part, the temperature probe element comprising a ceramic sensor element housing, a sensor element arranged in the ceramic sensor element housing, and electrical feed lines; wherein the ceramic sensor element housing is arranged at least in part in the first opening, and wherein the ceramic sensor element housing has a higher thermal conductivity than the first ceramic housing part. 16. The method according to claim 15 , wherein the first part and the second part are formed in one piece. 17. The method according to claim 16 , wherein the second part comprises recesses in which the electrical feed lines of the temperature probe element are arranged. 18. The method according to claim 17 , wherein the sensor element is an NTC sensor element. 19. A temperature sensor system, comprising: a first ceramic housing part comprising a sleeve-shaped first part, the sleeve-shaped first part comprising a first end having a first opening and a second end having a second opening; and a temperature probe element arranged at least in part in the sleeve-shaped first part, the temperature probe element comprising a ceramic sensor element housing, a sensor element arranged in the sensor element housing, and electrical feed lines, wherein the ceramic sensor element housing comprises a protrusion; wherein the ceramic sensor element housing is arranged in part in the first ceramic housing part such that the protrusion cooperates with an inner surface of the first part at the first end of the first ceramic housing part, and wherein the ceramic sensor element housing in part protrudes out of the first opening. 20. The temperature sensor system according to claim 19 , wherein the protrusion is connected to the first opening in a form-fitting manner by means of an adhesive bond.
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