Transfer molding method, die structure, transfer molding device, and optical member

Patent metadata

Field	Value
Publication number	US-10022897-B2
Application number	US-201314440644-A
Country	US
Kind code	B2
Filing date	Feb 8, 2013
Priority date	Nov 5, 2012
Publication date	Jul 17, 2018
Grant date	Jul 17, 2018

Abstract

A die structure has a first die, a second die that comes in contact with and separate from the first die, a heating unit provided in at least one of the first and second dies, and a transfer member provided in at least one of the first and second dies that brings a resin sheet supplied between the first and second dies into contact with a transfer surface and carrying out transfer molding, and a recess site formed on the transfer member near the transfer surface.

First claim

The invention claimed is:

1. A transfer molding method comprising:
transporting a resin sheet between a first die and a second die arranged facing each other where at least one of the first and second dies facing each other includes a surface that is a transfer surface with recesses and projections;
clamping the resin sheet between the first and second dies with the transfer surface in contact with at least one surface of the resin sheet; and
a transfer molding step, comprising;
applying heat to at least one of the first and second dies to transfer the transfer surface onto the at least one surface of the resin sheet,
forming a large thick portion protruding at a height greater than the maximum height of recesses and projections on the transfer surface using a recess site formed in at least one of the first and second dies, and
bringing the first and second dies near a position that reduces the thickness of all portions on the molded resin sheet other than the thick portion to less than the initial thickness thereof.

2. The transfer molding method according to claim 1 , wherein the height of the thick portion on the molded resin sheet is no less than ten times the maximum height of the recesses and projections on the surface molded using the transfer surface in the transfer molding step.

3. The transfer molding method according to claim 1 , wherein the resin sheet is heated to no less than a glass transition temperature in the transfer molding step.

4. The transfer molding method according to claim 1 , wherein the resin sheet is melted and flowed towards the recess site formed in at least one of the first and second dies to create the thick portion in the transfer molding step.

5. The transfer molding method according to claim 4 , wherein the resin flowed into the recess site formed in at least one of the first and second dies is resin from the outer surface of the melted resin sheet.

6. The transfer molding method according to claim 4 , wherein the resin flowing into the recess site formed in at least one of the first and second dies is obtained from a region of the resin sheet adjacent to a region facing the recess site.

7. The transfer molding method according to claim 1 , wherein an additional material is disposed within the recess site in the transfer molding step and melted along with at least a portion of the resin sheet to form the thick portion.

8. The transfer molding method according to claim 1 ,
wherein the resin sheet includes at least a protruding portion on at least one part thereof; and
wherein an additional material may be disposed within the recess site in the transfer molding step and melted along with at least a portion of the resin sheet to form the thick portion.

Assignees

• Omron Tateisi Electronics Co

Inventors

• Makuta Isao
• Takemura Koichi
• Shibata Tomofusa
• Yamanaka Yoshihisa
• Kitamura Norikazu
• Shinohara Masayuki
• Hirota Kazuhide
• Taguchi Toshikaga
• Kojima Masayuki
• Takahashi Yukihiro

Classifications

• B29L2011/0016

  Lenses · CPC title

• B29C2059/023

  Microembossing · CPC title

• G02B6/0046

  Tapered light guide, e.g. wedge-shaped light guide · CPC title

• G02B6/0065

  Manufacturing aspects; Material aspects · CPC title

• B29C2043/025

  forming a microstructure, i.e. fine patterning · CPC title