Transfer molding method, die structure, transfer molding device, and optical member
US-10022897-B2 · Jul 17, 2018 · US
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 50626945 |
| Family type | — |
| Earliest priority | Nov 5, 2012 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US10022897B2 — Transfer molding method, die structure, transfer molding device, and optical member |
Best representative member for this family based on priority and filing country.
US10022897B2 — Transfer molding method, die structure, transfer molding device, and optical member (published Jul 17, 2018)
Related publications in this family.