Single-body electrostatic chuck
US-8941969-B2 · Jan 27, 2015 · US
US10020218B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10020218-B2 |
| Application number | US-201514944018-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 17, 2015 |
| Priority date | Nov 17, 2015 |
| Publication date | Jul 10, 2018 |
| Grant date | Jul 10, 2018 |
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A method of manufacturing an electrostatic chuck includes polishing a surface of a ceramic body of the electrostatic chuck to produce a polished surface and depositing a ceramic coating onto the polished surface of the ceramic body to produce a coated ceramic body. The method further includes disposing a mask over the coated ceramic coating, the mask comprising a plurality of elliptical holes and depositing a ceramic material through the plurality of elliptical holes of the mask to form a plurality of elliptical mesas on the coated ceramic body, wherein the plurality of elliptical mesas have rounded edges. The mask is then removed from the coated ceramic body and the plurality of elliptical mesas are polished.
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What is claimed is: 1. An electrostatic chuck comprising: a ceramic body comprising an embedded electrode; a first ceramic coating on a surface of the ceramic body, wherein the first ceramic coating fills pores in the ceramic body, and wherein the first ceramic coating comprises a same material as the ceramic body; a second ceramic coating on the first ceramic coating; and a plurality of elliptical mesas on the second ceramic coating, the plurality of elliptical mesas having rounded edges. 2. The electrostatic chuck of claim 1 , wherein: the ceramic body comprises AlN or Al 2 O 3 ; the second ceramic coating comprises a material from the group consisting of Al 2 O 3 , AlN, Y 2 O 3 , Y 3 Al 5 O 12 (YAG), and AlON; and the plurality of elliptical mesas each comprise the material. 3. The electrostatic chuck of claim 1 , wherein the plurality of elliptical mesas comprises a plurality of circular mesas. 4. The electrostatic chuck of claim 3 , wherein: the second ceramic coating has a thickness of about 5-30 microns; and the plurality of circular mesas have a diameter of about 0.5-2.0 mm and a thickness of about 2-20 microns. 5. The electrostatic chuck of claim 1 , wherein the second ceramic coating has an average surface roughness of about 4-10 micro-inches. 6. The electrostatic chuck of claim 1 , wherein the second ceramic coating comprises an amorphous ceramic comprising Yttrium, Aluminum and Oxygen, wherein at least 8% of the amorphous ceramic is Yttrium. 7. A method comprising: polishing a surface of a ceramic body of an electrostatic chuck to produce a polished surface; depositing a ceramic coating onto the polished surface of the ceramic body to produce a coated ceramic body; disposing a mask over the coated ceramic body, the mask comprising a plurality of elliptical holes; depositing a ceramic material through the plurality of elliptical holes of the mask to form a plurality of elliptical mesas on the coated ceramic body, wherein the plurality of elliptical mesas have rounded edges; removing the mask from the coated ceramic body; and polishing the plurality of elliptical mesas. 8. The method of claim 7 , further comprising: depositing an initial ceramic coating onto the ceramic body prior to polishing the surface of the ceramic body, wherein the initial ceramic coating fills pores in the ceramic body. 9. The method of claim 8 , wherein the initial ceramic coating comprises a same material as the ceramic body. 10. The method of claim 7 , wherein: the ceramic body comprises AlN or Al 2 O 3 ; the ceramic coating comprises a material from the group consisting of Al 2 O 3 , AlN, Y 2 O 3 , Y 3 Al 5 O 12 (YAG), and AlON; and the plurality of elliptical mesas each comprise the material. 11. The method of claim 7 , wherein the ceramic coating comprises an amorphous ceramic comprising Yttrium, Aluminum and Oxygen, wherein at least 8% of the amorphous ceramic is Yttrium. 12. The method of claim 7 , wherein the plurality of elliptical holes in the mask are a plurality of circular holes that are flared at a top end and a bottom end. 13. The method of claim 12 , wherein the plurality of elliptical mesas are a plurality of circular mesas having a diameter of about 0.5-2.0 mm and a thickness of about 2-20 microns. 14. The method of claim 7 , wherein polishing the surface of the ceramic body comprises polishing the surface to an average surface roughness of about 4-10 micro-inches. 15. The method of claim 7 , wherein disposing the mask over the coated ceramic body comprises bonding the mask to the coated ceramic body using an adhesive. 16. The method of claim 7 , wherein depositing the ceramic coating onto the polished surface comprises depositing the ceramic coating to a thickness of about 5-30 microns. 17. A circular mask comprising: a body having a first diameter that is less than a second diameter of an electrostatic chuck onto which the mask is to be placed; and a plurality of elliptical through holes in the body, the plurality of elliptical through holes having an aspect ratio of approximately 1:2 to approximately 2:1, wherein at least one elliptical hole of the plurality of elliptical through holes comprises a flared top end and a flared bottom end, wherein the flared top end is to funnel particles through the at least one elliptical hole onto the electrostatic chuck to form an elliptical mesa on the electrostatic chuck, wherein the flared bottom end prevents the elliptical mesa from contacting the mask. 18. The circular mask of claim 17 , wherein the at least one elliptical hole is a circular hole having a diameter of approximately 0.5-2.0 mm and a thickness of approximately 1-3 mm. 19. The circular mask of claim 17 , wherein the flared top end and the flared bottom end each have a first diameter that is approximately 20-70% greater than a second diameter at a narrowest region of the at least one elliptical hole.
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