Chemistry compatible coating material for advanced device on-wafer particle performance

Patent metadata

Field	Value
Publication number	US-10020170-B2
Application number	US-201615084299-A
Country	US
Kind code	B2
Filing date	Mar 29, 2016
Priority date	Jul 27, 2012
Publication date	Jul 10, 2018
Grant date	Jul 10, 2018

Abstract

A method includes feeding powder comprising a yttrium oxide into a plasma spraying system, wherein the powder comprises a majority of donut-shaped particles, each of the donut-shaped particles having a spherical body with indentations on opposite sides of the spherical body. The method further includes plasma spray coating an article to apply a ceramic coating onto the article, wherein the ceramic coating comprises the yttrium oxide, wherein the donut-shaped particles cause the ceramic coating to have an improved morphology and a decreased porosity as compared to powder particles of other shapes, wherein the improved surface morphology comprises a reduced amount of surface nodules.

First claim

What is claimed is:

1. A method comprising:
setting plasma current for a plasma spraying system to between about 90 A and about 150 A;
positioning a torch standoff of the plasma spraying system to a distance from an article between about 60 mm and about 120 mm;
flowing gas through the plasma spraying system at a rate of between about 80 L/min and about 130 L/min;
feeding powder comprising a yttrium-based oxide into the plasma spraying system, wherein the powder comprises a majority of donut-shaped particles, each of the donut-shaped particles having a spherical body with indentations on opposite sides of the spherical body; and
plasma spray coating the article to apply a ceramic coating onto the article, wherein the ceramic coating comprises the yttrium-based oxide, wherein the donut-shaped particles cause the ceramic coating to have an improved surface morphology and a decreased porosity as compared to powder particles having a spherical shape, wherein the improved surface morphology comprises a reduced amount of surface nodules.

2. The method of claim 1 , wherein the yttrium-based oxide comprises a compound of Y 4 Al 2 O 9 (YAM) and a solid solution of Y 2 O 3 —ZrO 2 .

3. The method of claim 2 , wherein the compound comprises Y 2 O 3 in a range from about 50 mol % to about 75 mol %, ZrO 2 in a range from about 10 mol % to about 30 mol %, and Al 2 O 3 in a range from about 10 mol % to about 30 mol %.

4. The method of claim 1 , wherein the ceramic coating comprises about 62.93 mol % Y 2 O 3 , about 23.13 mol % ZrO 2 , and about 13.94 mol % Al 2 O 3 .

5. The method of claim 1 , wherein the amount of nodules per inch is in a range from about 30 nodules to about 45 nodules.

6. The method of claim 1 , wherein the decreased porosity is in a range from about 2.5% to about 3.2%.

7. The method of claim 1 , further comprising:
setting plasma current for the plasma spraying system to between about 110 A and about 150 A.

8. The method of claim 1 , wherein about 50% of the powder has a diameter less than about 15 microns.

9. The method of claim 1 , further comprising:
rotating the article to expose a plurality of portions of the article while plasma spray coating the article.

10. The method of claim 9 , wherein the plasma spray coating comprises applying one or more coats by:
coating a back side of the article, wherein the coating is applied at a 45 degree angle to the rotating article as the plasma spray system is moved perpendicular to an axis of rotation of the article, and the back side coating having a thickness about 2 mil;
coating an outer diameter of the article, wherein the coating is applied horizontally to the rotating article as the plasma spray system is moved parallel to the axis of rotation of the article, and the outer diameter coating is applied about 2 mil thick; and
coating a front side of the article, wherein the article is flipped and the coating is applied at an approximately 45 degree to the rotating article as the plasma spray system is moved perpendicular to an axis of rotation of the article, and the front side coating is applied about 2 mil thick.

11. The method of claim 1 , wherein the article comprises a plasma screen for a semiconductor processing chamber, wherein the plasma screen comprises at least one of Al, Al 2 O 3 , or SiC.

12. The method of claim 1 , further comprising:
maintaining an angle of approximately 45 degrees between a plasma spray nozzle and a surface of the article while plasma spray coating the article.

13. The method of claim 12 , wherein maintaining the angle of approximately 45 degrees comprises rotating at least one of the plasma spray nozzle or the article while plasma spray coating the article.

14. The method of claim 1 , wherein the article comprises a front side, a back side and an outer diameter, and wherein a thickness of the ceramic coating on the front side and on the back side is greater than a thickness of the ceramic coating on the outer diameter.

15. The method of claim 1 , further comprising:
performing a first number of plasma spray passes on a first portion of the article; and
performing a second number of plasma spray passes on a second portion of the article, wherein the first number is greater than the second number.

16. The method of claim 1 , wherein a surface roughness of the ceramic coating is from about 220 micro-inches to about 250 micro-inches.

17. A method comprising:
setting plasma current for a plasma spraying system to between about 90 A and about 150 A;
positioning a torch standoff of the plasma spraying system to a distance from a body between about 60 mm and about 120 mm;
flowing gas through the plasma spraying system at a rate of between about 80 L/min and about 130 L/min;
feeding powder comprising Y 2 O 3 , ZrO 2 , and Al 2 O 3 into the plasma spraying system, wherein the powder comprises a majority of donut-shaped particles, each of the donut-shaped particles having a spherical body with indentations on opposite sides of the spherical body; and
plasma spray coating an article to apply a ceramic coating onto the article, wherein the ceramic coating comprises a compound of Y 4 Al 2 O 9 (YAM) and a solid solution of Y 2 O 3 —ZrO 2 , wherein the donut-shaped particles cause the ceramic coating to have an improved surface morphology, a reduced surface roughness and a decreased porosity as compared to powder particles having a spherical shape, wherein the improved surface morphology comprises a reduced amount of surface nodules.

18. A method comprising:
setting plasma current for a plasma spraying system to between about 90 A and about 150 A;
positioning a torch standoff of the plasma spraying system to a distance from a body between about 60 mm and about 120 mm;
flowing gas through the plasma spraying system at a rate of between about 80 L/min and about 130 L/min;
feeding powder comprising a yttrium-containing oxide into the plasma spraying system, wherein the powder comprises a majority of donut-shaped particles, each of the donut-shaped particles having a spherical body with indentations on opposite sides of the spherical body; and
plasma spray coating an article to apply a ceramic coating onto the article, wherein the ceramic coating comprises a compound of Y 4 Al 2 O 9 (YAM) and a solid solution of Y 2 O 3 —ZrO 2 , the compound comprising Y 2 O 3 in a range from about 50 mol % to about 75 mol %, ZrO 2 in a range from about 10 mol % to about 30 mol %, and Al 2 O 3 in a range from about 10 mol % to about 30 mol %, wherein the donut-shaped particles cause the ceramic coating to have an improved surface morphology, a reduced surface roughness and a decreased porosity as compared to powder particles having a spherical shape, wherein the improved surface morphology comprises a reduced amount of surface nodules.

Assignees

• Applied Materials Inc

Inventors

• Sun Jennifer Y
• Kanungo Biraja P
• Lubomirsky Dmitry

Classifications

• H10P95/00

  Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass · CPC title

• H10P72/0421

  for drying etching · CPC title

• H10P72/0402

  Apparatus for fluid treatment (H10P72/0441, H10P72/0448 take precedence) · CPC title

• H10P50/242

  of Group IV materials · CPC title

• H10P14/6319

  Formation by plasma treatments, e.g. plasma oxidation of the substrate · CPC title