Systems Comprising Silicon Coated Gas Supply Conduits and Methods for Applying Coatings
US-2017040147-A1 · Feb 9, 2017 · US
US10017861B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10017861-B2 |
| Application number | US-201113197075-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 3, 2011 |
| Priority date | Aug 3, 2011 |
| Publication date | Jul 10, 2018 |
| Grant date | Jul 10, 2018 |
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Disclosed are methods for treating metal substrates that include contacting the substrate with a pretreatment composition comprising a rare earth metal and a zirconyl compound. The present invention also relates to coated substrates produced thereby and further to substrates additionally coated with an electrophoretically applied coating composition.
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We claim: 1. A pretreatment composition for treating a metal substrate comprising: (a) a soluble rare earth metal; (b) a zirconyl compound; and (c) an electropositive metal, wherein the pretreatment composition contains no free fluoride, wherein the pretreatment composition is free of phosphate ions, wherein a ratio of zirconium from said zirconyl compound to said rare earth metal in the pretreatment composition is 200/1 and 1/1, and wherein upon contact with the metal substrate, the pretreatment composition reacts with and chemically alters a surface of the metal substrate and binds to the surface of the metal substrate to form a protective layer. 2. The pretreatment composition of claim 1 , wherein said zirconyl compound (b) comprises zirconyl nitrate, zirconyl acetate, zirconyl carbonate, protonated zirconium basic carbonate, zirconyl sulfate, zirconyl chloride, zirconyl iodide, zirconyl bromide or a mixture thereof. 3. The pretreatment composition of claim 1 further comprising: (d) a group IVB and/or group VB metal. 4. The pretreatment composition of claim 3 , wherein the amount of metal from said zirconyl compound and from said group IVB and/or group VB metal in the pretreatment composition comprises from 10 ppm to 5000 ppm. 5. The pretreatment composition of claim 1 , wherein said rare earth metal (a) comprises yttrium, praseodymium, cerium, or mixtures thereof. 6. The pretreatment composition of claim 1 , wherein a source of said rare earth metal (a) comprises a rare earth metal compound. 7. The pretreatment composition of claim 6 , wherein said rare earth metal compound comprises a compound of yttrium, cerium, praseodymium, or a mixture thereof. 8. The pretreatment composition of claim 1 , wherein the amount of zirconium from said zirconyl compound in the pretreatment composition comprises from 10 ppm to 5000 ppm. 9. The pretreatment composition of claim 1 , wherein said electropositive metal is more electropositive than the metal substrate. 10. The pretreatment composition of claim 1 , wherein the pretreatment composition is substantially free of heavy metal phosphate. 11. The pretreatment composition of claim 1 , wherein the pretreatment composition is completely free of heavy metal phosphate. 12. A method for treating a metal substrate comprising: (a) contacting the metal substrate with a pretreatment composition comprising a soluble rare earth metal, a zirconyl compound, and an electropositive metal, wherein the pretreatment composition contains no free fluoride, wherein the pretreatment composition is free of phosphate ions, wherein a ratio of zirconium from said zirconyl compound to said rare earth metal in the pretreatment composition is 200/1 and 1/1, and wherein upon contact with the metal substrate, the pretreatment composition reacts with and chemically alters a surface of the metal substrate and binds to the surface of the metal substrate to form a protective layer. 13. The method according to claim 12 , wherein said pretreatment composition is contacted to the metal substrate without the prior application of an electropositive metal. 14. The method of claim 12 , wherein said pretreatment composition further comprises a group IVB and/or group VB metal. 15. The method of claim 12 further comprising electrophoretically depositing a coating composition onto the metal substrate after step (a).
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