Magnetic field annealing for integrated fluxgate sensors

Patent metadata

Field	Value
Publication number	US-10017851-B2
Application number	US-201514979003-A
Country	US
Kind code	B2
Filing date	Dec 22, 2015
Priority date	Dec 22, 2015
Publication date	Jul 10, 2018
Grant date	Jul 10, 2018

Abstract

A method of magnetic forming an integrated fluxgate sensor includes providing a patterned magnetic core on a first nonmagnetic metal or metal alloy layer on a dielectric layer over a first metal layer that is on or in an interlevel dielectric layer (ILD) which is on a substrate. A second nonmagnetic metal or metal alloy layer is deposited including over and on sidewalls of the magnetic core. The second nonmagnetic metal or metal alloy layer is patterned, where after patterning the second nonmagnetic metal or metal alloy layer together with the first nonmagnetic metal or metal alloy layer encapsulates the magnetic core to form an encapsulated magnetic core. After patterning, the encapsulated magnetic core is magnetic field annealed using an applied magnetic field having a magnetic field strength of at least 0.1 T at a temperature of at least 150° C.

First claim

The invention claimed is:

1. A method of forming an integrated fluxgate sensor, comprising:
providing a patterned magnetic core on a first nonmagnetic metal or metal alloy layer on a dielectric layer over a first metal layer that is on or in an interlevel dielectric layer (ILD) which is on a substrate;
depositing a second nonmagnetic metal or metal alloy layer including over and on sidewalls of said magnetic core;
patterning said second nonmagnetic metal or metal alloy layer, wherein after said patterning said second nonmagnetic metal or metal alloy layer together with said first nonmagnetic metal or metal alloy layer encapsulates said magnetic core to form an encapsulated magnetic core, and
after said patterning, magnetic field annealing said encapsulated magnetic core using an applied magnetic field having a magnetic field strength of at least 0.1 T at a temperature of at least 150° C.

2. The method of claim 1 , further comprising forming vias through said ILD for coupling said fluxgate sensor to functional circuitry formed on said substrate.

3. The method of claim 2 , wherein said substrate comprises a silicon wafer and said functional circuitry comprises a plurality of: drive circuitry for driving a current-sensing feedback loop, a filter configured to work with said magnetic core, an H-Bridge circuit, a voltage reference, and a shunt sense amplifier.

4. The method of claim 1 , wherein said first nonmagnetic metal or metal alloy layer and said second nonmagnetic metal or metal alloy layer both comprise Ti.

5. The method of claim 1 , wherein said magnetic field annealing has a magnetic field strength of 0.7 T to 1.3 T, said temperature is from 325° C. to 425° C., and a time at said temperature is from 15 to 120 minutes.

6. The method of claim 1 , wherein an ambient for said magnetic field annealing is a non-oxidizing ambient comprising at least one of N 2 , forming gas, and an inert gas.

7. The method of claim 1 , wherein a pressure during said magnetic field annealing is from 1 Torr to 100 Torr.

8. The method of claim 1 , wherein said magnetic core comprises permalloy, NiFeMo, CoNbZr, or CoTaZr.

9. The method of claim 8 , wherein said magnetic core comprises a multilayered stack of alternating layers of magnetic core material and a dielectric material selected from a group consisting of aluminum oxide, silicon dioxide, aluminum nitride, and combinations thereof.

10. The method of claim 1 , wherein said first nonmagnetic metal or metal alloy layer extends past said magnetic core by at least about 1.5 microns on all lateral sides and said second nonmagnetic metal or metal alloy layer extends past said magnetic core by at least about 1.5 microns on all lateral sides.

11. The method of claim 10 , wherein said first nonmagnetic metal or metal alloy layer has a thickness in a range of 30 nm to 50 nm and wherein said second nonmagnetic metal or metal alloy layer has a thickness in a range of 90 nm to 300 nm.

12. A method of forming an integrated fluxgate sensor, comprising:
providing a patterned magnetic core on a first nonmagnetic metal or metal alloy layer comprising Ti on a dielectric layer over a first metal layer that is on or in an interlevel dielectric layer (ILD) which is on a substrate;
depositing a second nonmagnetic metal or metal alloy layer comprising Ti including over and on sidewalls of said magnetic core;
patterning said second nonmagnetic metal or metal alloy layer, wherein after said patterning said second nonmagnetic metal or metal alloy layer together with said first nonmagnetic metal or metal alloy layer encapsulates said magnetic core to form an encapsulated magnetic core, and
after said patterning, magnetic field annealing said encapsulated magnetic core using an applied magnetic field having a magnetic field strength of 0.7 T to 1.3 T at a temperature from 325° C. to 425° C. with a pressure between 1 Torr and 100 Torr.

13. The method of claim 12 , wherein said magnetic field annealing is under a N 2 atmosphere and a time at said temperature is from 15 to 120 minutes.

14. The method of claim 12 , further comprising forming vias through said ILD for coupling said fluxgate sensor to functional circuitry formed on said substrate.

15. The method of claim 14 , wherein said substrate comprises a silicon wafer and said functional circuitry comprises a plurality of: drive circuitry for driving a current-sensing feedback loop, a filter configured to work with said magnetic core, an H-Bridge circuit, a voltage reference, and a shunt sense amplifier.

Assignees

• Texas Instruments Inc

Inventors

• Lee Dok Won
• Eissa Mona
• Murphy Neal Thomas

Classifications

• C23C16/56

  After-treatment · CPC title

• G01R33/04 Primary

  using the flux-gate principle · CPC title

• G01R33/045

  in single-, or multi-aperture elements · CPC title

• G01R33/05

  in thin-film element · CPC title

• C23C16/06 Primary

  characterised by the deposition of metallic material · CPC title