Foldable fabric-based packaging solution

Patent metadata

Field	Value
Publication number	US-10014710-B2
Application number	US-201514964466-A
Country	US
Kind code	B2
Filing date	Dec 9, 2015
Priority date	Dec 9, 2015
Publication date	Jul 3, 2018
Grant date	Jul 3, 2018

Abstract

Methods, systems, and apparatuses for a foldable fabric-based semiconductor package (FFP) that can assist with charging a secondary cell are described. An FFP includes: a ground plane; a first component over the ground plane; a second component adjacent to the ground plane; a third component adjacent to the second component; a molding compound encapsulating the ground plane, the first component, the second component, and the third component; a first fabric layer on a top side of the molding compound; and a second fabric layer on a bottom side of the molding compound. Each of the first, second, and third components includes one or more semiconductor dies. The third component is electrically coupled to each of the first and second components. The first and second components can wireless charge the secondary cell. The third component can power the first and second components. The ground plane can protect against electromagnetic signals.

First claim

What is claimed is:

1. A semiconductor package comprising:
an electrically conductive ground plane;
a first component over the ground plane, the first component including one or more semiconductor dies;
a second component adjacent to the ground plane, the second component including one or more semiconductor dies;
a third component adjacent to the second component, the third component being electrically coupled to each of the first and second components, and the third component including one or more semiconductor dies;
a molding compound encapsulating the ground plane, the first component, the second component, and the third component, wherein the molding compound includes one or more molding compound layers (MC layers);
a first fabric layer on a top side of the molding compound; and
a second fabric layer on a bottom side of the molding compound.

2. The package of claim 1 , wherein a top side of the first component is substantially coplanar with the top side of the molding compound and wherein bottom sides of the ground plane, the second component, and the third component are substantially coplanar with the bottom side of the molding compound.

3. The package of claim 1 , wherein the molding compound covers at least one side of each of the ground plane, the first component, the second component, and the third component.

4. The package of claim 1 , wherein the first component is configured to wirelessly transfer energy to a secondary cell of an electronic device, wherein the second component is configured to wirelessly transfer energy to the secondary cell of the electronic device, wherein the third component is configured to transfer energy to each of the first and second components, and wherein the ground plane is configured to shield against electromagnetic signals associated with the wireless transfer of energy to the secondary cell.

5. The package of claim 1 , wherein each of the molding compound, the first fabric layer, and the second fabric layer is a foldable material.

6. The package of claim 1 , further comprising:
a first adhesive layer between the first fabric layer and the top side of the molding compound, wherein the first adhesive layer adhesively attaches the first fabric layer to the top side of the molding compound; and
a second adhesive layer between the second fabric layer and the bottom side of the molding compound, wherein the second adhesive layer adhesively attaches the second fabric layer to the bottom side of the molding compound.

7. The package of claim 1 , wherein the first component is directly over the ground plane, wherein the second component is laterally adjacent to the ground plane, and the third component is laterally adjacent to the second component.

8. The package of claim 1 , further comprising:
a fourth component adjacent to the third component, the fourth component being electrically coupled to each of the first, second, and third components, and the fourth component including one or more semiconductor dies.

9. The package of claim 8 , wherein the fourth component is configured as at least one of a display device, an audio device, or a haptic device, wherein the fourth component communicates information about at least one of the first, second, or third components.

10. A wearable comprising:
a circuit board; and
a semiconductor package coupled to the circuit board, the package including
an electrically conductive ground plane;
a first component over the ground plane, the first component including one or more semiconductor dies;
a second component adjacent to the ground plane, the second component including one or more semiconductor dies;
a third component adjacent to the second component, the third component being electrically coupled to each of the first and second components,
and the third component including one or more semiconductor dies;

a molding compound encapsulating the ground plane, the first component, the second component, and the third component, wherein the molding compound includes one or more molding compound layers (MC layers);
a first fabric layer on a top side of the molding compound; and
a second fabric layer on a bottom side of the molding compound.

11. The wearable of claim 10 , wherein a top side of the first component is substantially coplanar with the top side of the molding compound and wherein bottom sides of the ground plane, the second component, and the third component are substantially coplanar with the bottom side of the molding compound.

12. The wearable of claim 10 , wherein the molding compound covers at least one side of each of the ground plane, the first component, the second component, and the third component.

13. The wearable of claim 10 , wherein the first component is configured to wirelessly transfer energy to a secondary cell of an electronic device, wherein the second component is configured to wirelessly transfer energy to the secondary cell of the electronic device, wherein the third component is configured to transfer energy to each of the first and second components, and wherein the ground plane is configured to shield against electromagnetic signals associated with the wireless transfer of energy to the secondary cell.

14. The wearable of claim 10 , wherein each of the molding compound, the first fabric layer, and the second fabric layer is a foldable material.

15. The wearable of claim 10 , wherein the package further comprises:
a first adhesive layer between the first fabric layer and the top side of the molding compound, wherein the first adhesive layer adhesively attaches the first fabric layer to the top side of the molding compound; and
a second adhesive layer between the second fabric layer and the bottom side of the molding compound, wherein the second adhesive layer adhesively attaches the second fabric layer to the bottom side of the molding compound.

16. The wearable of claim 10 , wherein the first component is directly over the ground plane, wherein the second component is laterally adjacent to the ground plane, and the third component is laterally adjacent to the second component.

17. The wearable of claim 10 , wherein the package further comprises:
a fourth component adjacent to the third component, the fourth component being electrically coupled to each of the first, second, and third components, and the fourth component including one or more semiconductor dies, wherein the first component is configured to wirelessly transfer energy to a secondary cell of an electronic device, wherein the second component is configured to wirelessly transfer energy to the secondary cell of the electronic device, wherein the third component is configured to transfer energy to each of the first and second components, and wherein the ground plane is configured to shield against electromagnetic signals associated with the wireless transfer of energy to the secondary cell, and wherein the fourth component is configured to communicate information regarding one or more operations performed by at least one of the first, second, or third components.

Assignees

• Intel Corp

Inventors

• Cheah Bok Eng
• Kong Jackson Chung Peng
• Ooi Kooi Chi
• Schaecher Mark A
• Yew Teong Guan
• Goh Eng Huat

Classifications

• H01F38/14

  Inductive couplings {(for wireless supply or distribution of electric power using inductive coupling H02J50/10)} · CPC title

• H02J50/10

  using inductive coupling · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W74/114

  by a substrate and the encapsulations · CPC title

• H10W74/019

  using temporary auxiliary substrates (H10W74/017 takes precedence) · CPC title