Underfill material, laminated sheet and method for producing semiconductor device

Patent metadata

Field	Value
Publication number	US-10014235-B2
Application number	US-201515124002-A
Country	US
Kind code	B2
Filing date	Feb 20, 2015
Priority date	Mar 7, 2014
Publication date	Jul 3, 2018
Grant date	Jul 3, 2018

Abstract

An underfill material having sufficient curing reactivity, and capable of achieving a small change in viscosity and good electrical connection even when loaded with thermal history, a laminated sheet including the underfill material, and a method for manufacturing a semiconductor device. The underfill material has a melt viscosity at 150° C. before heating treatment of 50 Pa·s or more and 3,000 Pa·s or less, a viscosity change rate of 500% or less, at 150° C. as a result of the heating treatment, and a reaction rate represented by {(Qt−Qh)/Qt}×100% of 90% or more, where Qt is a total calorific value in a process of temperature rise from −50° C. to 300° C. and Qh is a total calorific value in a process of temperature rise from −50° C. to 300° C. after heating at 175° C. for 2 hours in a DSC measurement.

First claim

The invention claimed is:

1. An underfill material, wherein
a melt viscosity at 150° C. before heating treatment is 50 Pa·s or more and 3,000 Pa·s or less,
a viscosity change rate represented by (η2/η1)×100% is 500% or less, where η1 is a melt viscosity at 150° C. before heating treatment and η2 is a melt viscosity at 150° C. after heating treatment at 130° C. for 1 hour, and
a reaction rate represented by {(Qt−Qh)/Qt}×100% is 90% or more, where Qt is a total calorific value in a process of temperature rise from −50° C. to 300° C. and Qh is a total calorific value in a process of temperature rise from −50° C. to 300° C. after heating at 175° C. for 2 hours in a DSC measurement.

2. The underfill material according to claim 1 , comprising a latent curing accelerator.

3. The underfill material according to claim 2 , comprising an acrylic resin, and 1 part by weight to 2 parts by weight of the latent curing accelerator relative to 100 parts by weight of the acrylic resin.

4. A laminated sheet, comprising
a pressure-sensitive adhesive tape having a base material and a pressure-sensitive adhesive layer provided on the base material, and
the underfill material according to claim 1 laminated on the pressure-sensitive adhesive layer.

5. A method for manufacturing a semiconductor device comprising an adherend, a semiconductor element electrically connected to the adherend, and an underfill material filling a space between the adherend and the semiconductor element, the method comprising:
a step of preparing a semiconductor element with an underfill material in which the underfill material according to claim 1 is bonded to the semiconductor element, and
a connecting step of electrically connecting the semiconductor element with the adherend while filling the space between the adherend and the semiconductor element with the underfill material.

Assignees

• Nitto Denko Corp

Inventors

• Takamoto Naohide
• Hanazono Hiroyuki
• Fukui Akihiro

Classifications

• H10P72/7404

  the wafer tape being a laminate of three or more layers, e.g. including additional layers beyond a base layer and an uppermost adhesive layer · CPC title

• H10W99/00

  Subject matter not provided for in other groups of this subclass · CPC title

• H10W90/26

  the stacked chips being of the same size without any chips being laterally offset, e.g. chip stacks having a rectangular shape · CPC title

• H10W90/297

  characterised by the through-semiconductor vias [TSVs] in the stacked chips · CPC title

• H10W72/0198

  batch processes · CPC title