Potential equalization in a control device for a motor vehicle

Patent metadata

Field	Value
Publication number	US-10010017-B2
Application number	US-201314646776-A
Country	US
Kind code	B2
Filing date	Sep 26, 2013
Priority date	Nov 23, 2012
Publication date	Jun 26, 2018
Grant date	Jun 26, 2018

Abstract

An arrangement for potential equalization in a control device for a motor vehicle includes at least one electrical component on a circuit carrier, a carrier structure on which the circuit carrier is arranged, and at least one contacting element that electroconductively connects the circuit carrier to the carrier structure by way of a connecting element that forms a potential equalization. The contacting element has a bondable surface coating.

First claim

The invention claimed is:

1. An arrangement for potential equalization in a control device for a motor vehicle, comprising:
a carrier structure;
a circuit carrier disposed on said carrier structure;
at least one electrical component disposed on said circuit carrier; and
at least one contact-making element protruding at least partially into said carrier structure;
said at least one contact-making element connecting said circuit carrier to said carrier structure electrically conductively by way of a connecting element in order to establish potential equalization; and
a bondable surface coating disposed on said contact-making element between said contact-making element and said connecting element.

2. The arrangement according to claim 1 , wherein said surface coating is an electrodeposited coating or a chemically deposited coating on said contact-making element.

3. The arrangement according to claim 2 , wherein said surface coating comprises a material selected from the group consisting of aluminum, copper, silver, and a compound thereof.

4. The arrangement according to claim 2 , wherein said surface coating comprises a compound selected from the group consisting of nickel/gold, nickel/silver, nickel/palladium/gold and nickel/palladium/silver.

5. The arrangement according to claim 1 , wherein said contact-making element is connected to said carrier structure with a force-fit or with a positively locking connection by way of a screw or rivet connection.

6. The arrangement according to claim 1 , wherein said carrier structure is a part of a control device housing.

7. The arrangement according to claim 6 , wherein said carrier structure is a base plate of said control device housing.

8. The arrangement according to claim 1 , wherein said circuit carrier ( 4 ) is a printed circuit board.

9. The arrangement according to claim 1 , wherein said circuit carrier is a printed circuit board with a ceramic substrate.

10. The arrangement according to claim 1 , wherein said connecting element is a wire bond.

11. The arrangement according to claim 10 , wherein said wire bond is a ground bond.

12. A control device for a motor vehicle, comprising the arrangement for potential equalization according to claim 1 .

13. A method of producing an arrangement for potential equalization in a control device for a motor vehicle, the method comprising the following steps:
providing a control device with a circuit carrier and a carrier structure;
providing a contact-making element with a bondable surface coating, and an electrically conductive connecting element;
establishing a force-fitting or positively locking connection between the contact-making element and the carrier structure, the connection being electrically conductive; and
establishing an electrically conductive connection between the contact-making element and the circuit carrier by way of the connecting element.

14. The method according to claim 13 , wherein the surface coating is electrodeposited or chemically deposited on the contact-making element.

15. An arrangement for potential equalization in a control device for a motor vehicle, comprising:
a carrier structure;
a circuit carrier disposed on said carrier structure;
at least one electrical component disposed on said circuit carrier;
a connecting element, said connecting element being a wire bond and said wire bond being a ground bond;
at least one contact-making element protruding at least partially into said carrier structure and connecting said circuit carrier to said carrier structure electrically conductively by way of said connecting element in order to establish potential equalization;
said at least one contact-making element having a bondable surface coating disposed on said contact-making element between said contact-making element and said connecting element, comprising a compound selected from the group consisting of nickel/gold, nickel/silver, nickel/palladium/gold and nickel/palladium/silver.

Assignees

• Conti Temic Microelectronic Gmbh

Inventors

• Taschner Nikolaus
• Schuch Bernhard

Classifications

• H05K1/0215

  Grounding of printed circuits by connection to external grounding means · CPC title

• H05K1/0306

  Inorganic insulating substrates, e.g. ceramic, glass · CPC title

• H05K7/06

  on insulating boards {, e.g. wiring harnesses (for printed circuits H05K1/18, H05K3/30)} · CPC title

• Y10T29/49224

  with coating · CPC title

• H05K3/244

  Finish plating of conductors, especially of copper conductors, e.g. for pads or lands (selective plating methods H05K3/243; finish plating of conductors made by printing techniques H05K3/246; solder as finish H05K3/3465) · CPC title