Grounding part, electronic device, imaging device, and grounding part production method

Patent metadata

Field	Value
Publication number	US-9491848-B2
Application number	US-201414539041-A
Country	US
Kind code	B2
Filing date	Nov 12, 2014
Priority date	Nov 25, 2013
Publication date	Nov 8, 2016
Grant date	Nov 8, 2016

Abstract

A grounding part, an electronic device, an imaging device, and a method of producing a grounding part are provided. The grounding part includes a first connecting component made of an electrically conductive material and connected to a circuit board having an electronic component thereon, and a second connecting component made of an electrically conductive material and connected to the first connecting component and a grounding member. The first connecting component includes a substrate connecting part connected to the circuit board, and a second-connecting-component connecting part connected to the second connecting component, and the second connecting component includes a first-connecting-component connecting part connected to the first connecting component, and a grounding-part connecting part connected to the grounding member. The imaging device includes the circuit board and the grounding member. The method includes a method for producing the first connecting component and a method for producing the second connecting component.

First claim

What is claimed is:

1. A grounding part comprising:
a first connecting component made of an electrically conductive material and connected to a circuit board having an electronic component thereon; and
a second connecting component made of an electrically conductive material and connected to the first connecting component and a grounding member,
wherein
the first connecting component includes
a substrate connecting part connected to the circuit board, and
a second-connecting-component connecting part connected to the second connecting component, and

the second connecting component includes
a first-connecting-component connecting part connected to the first connecting component, and
a grounding-part connecting part connected to the grounding member.

2. The grounding part according to claim 1 , further comprising a third connecting component connected to the grounding member and the second connecting component.

3. The grounding part according to claim 1 , wherein the substrate connecting part is connected to a conductive part formed on a back side of the circuit board.

4. The grounding part according to claim 1 , wherein the first connecting component comprises:
a leg part connected to the substrate connecting part; and
a bent part formed between and continuous with a first substrate connecting part and the leg part.

5. The grounding part according to claim 4 , wherein the bent part includes a deformable opening.

6. The grounding part according to claim 4 , wherein the first connecting component includes a plurality of first connecting components at positions facing the substrate connecting part having the leg part therebetween.

7. The grounding part according to claim 1 , further comprising a fourth connecting component made of an electrically conductive material and connected to the first connecting component and the circuit board.

8. The grounding part according to claim 1 , wherein the second connecting component is made of a deformable material.

9. The grounding part according to claim 8 , wherein the second connecting component is made of a sheet of copper foil.

10. An electronic device comprising:
a circuit board having an electronic component thereon; and
a grounding member having a reference potential,
wherein the circuit board is grounded to the grounding member by the grounding part according to claim 1 .

11. An imaging device comprising:
a circuit board having an electronic component thereon; and
a grounding member having a reference potential,
wherein
the circuit board is grounded to the grounding member by a grounding part,
the grounding part includes
a first connecting component made of an electrically conductive material and connected to a circuit board having an electronic component thereon; and
a second connecting component made of an electrically conductive material and connected to the first connecting component and a grounding member,

the first connecting component includes
a substrate connecting part connected to the circuit board, and
a second-connecting-component connecting part connected to the second connecting component, and

the second connecting component includes
a first-connecting-component connecting part connected to the first connecting component, and
a grounding-part connecting part connected to the grounding member.

12. The imaging device according to claim 11 , wherein the grounding part includes a third connecting component connected to the grounding member and the second connecting component.

13. The imaging device according to claim 11 , wherein the substrate connecting part is connected to the conductive part formed on a back side of the circuit board.

14. The imaging device according to claim 11 , wherein the first connecting component comprises:
a leg part connected to the substrate connecting part; and
a bent part formed between and continuous with a first substrate connecting part and the leg part.

15. The imaging device according to claim 14 , wherein the bent part includes a deformable opening.

16. The imaging device according to claim 14 , wherein the first connecting part includes a plurality of first connecting components at positions facing the substrate connecting part having the leg part therebetween.

17. The imaging device according to claim 11 , wherein the grounding part includes a fourth connecting component made of an electrically conductive material and connected to the first connecting component and the circuit board.

18. The imaging device according to claim 11 , wherein the second connecting component is made of a deformable material.

19. The imaging device according to claim 18 , wherein the second connecting component is made of a sheet of copper foil.

20. A method of producing a grounding part, the grounding part including a first connecting component made of an electrically conductive material and connected to a circuit board having an electronic component thereon, and a second connecting component made of an electrically conductive material and connected to the first connecting component and a grounding member,
the method comprising:
forming a substrate connecting part connected to the circuit board;
forming a second-connecting-component connecting part connected to the second connecting component;
forming a first-connecting-component connecting part connected to the first connecting component; and
forming a grounding-part connecting part connected to the grounding member.

Assignees

• Yamashita Naoyuki
• Ricoh Co Ltd

Inventors

• Yamashita Naoyuki

Classifications

• H04N23/57 Primary

  Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices · CPC title

• H05K1/0215 Primary

  Grounding of printed circuits by connection to external grounding means · CPC title

• H04N5/2251

  Electricity · mapped topic

• H05K1/0216

  Reduction of cross-talk, noise or electromagnetic interference (grounding H05K1/0215) · CPC title

• H04N5/2257

  Electricity · mapped topic