Semiconductor module adapted to be inserted into connector of external device

Patent metadata

Field	Value
Publication number	US-10008488-B2
Application number	US-201715489031-A
Country	US
Kind code	B2
Filing date	Apr 17, 2017
Priority date	Apr 20, 2016
Publication date	Jun 26, 2018
Grant date	Jun 26, 2018

Abstract

In one embodiment, the semiconductor module includes a module substrate and a first substrate mounted on and electrically connected to a first surface of the module substrate. The first substrate has one or more first electrical connectors of the semiconductor module, and the first substrate electrically connecting the first electrical connector to the module substrate.

First claim

What is claimed is:

1. A semiconductor module, comprising:
a module substrate including at least one first chip on a first surface of the module substrate and at least one second chip on a second surface of the module substrate, the second surface being opposite to the first surface;
a first substrate mounted on and electrically connected to the first surface of the module substrate, the first substrate having one or more first electrical connectors, the one or more first electrical connectors electrically connecting the first substrate to the at least one first chip via the module substrate; and
a second substrate mounted on and electrically connected to the second surface of the module substrate, the second substrate having one or more second electrical connectors, the one or more second electrical connectors electrically connecting the second substrate to the at least one second chip via the module substrate.

2. The semiconductor module of claim 1 , wherein the module substrate has a first region and a second region, and the first substrate is mounted on the module substrate in the first region.

3. The semiconductor module of claim 2 , wherein an edge of the first substrate is aligned with an edge of the module substrate.

4. The semiconductor module of claim 3 , wherein the first electrical connector is a tap extending on an outer surface of the first substrate perpendicularly from the edge of the first substrate.

5. The semiconductor module of claim 4 , wherein the first substrate includes a plurality of taps arranged in column along the edge of the first substrate.

6. The semiconductor module of claim 5 , further comprising:
a mold layer over the first surface of the module substrate and partially covering the first substrate such that the plurality of taps remain exposed.

7. The semiconductor module of claim 2 , wherein the first electrical connector is a tap extending on an outer surface of the first substrate perpendicularly from an edge of the first substrate.

8. The semiconductor module of claim 2 , wherein an outer surface of the first substrate is at a different level than the first surface of the module substrate in the second region.

9. The semiconductor module of claim 2 , wherein a thickness of the semiconductor module at the first region meets a thickness requirement for a standardized connector.

10. The semiconductor module of claim 2 , further comprising:
at least one chip mounted to the module substrate in the second region.

11. The semiconductor module of claim 2 , further comprising:
at least one package mounted to the module substrate in the second region.

12. The semiconductor module of claim 1 , wherein at least one solder ball electrically connects the first substrate to the module substrate.

13. A semiconductor module, comprising:
a main substrate; and
a connection substrate and at least one chip mounted on a first surface of the main substrate, and the connection substrate including one or more taps for electrically connecting the semiconductor module to an external device,
wherein the at least one chip does not overlap the taps in a plan view, and
the at least one chip is electrically connected to at least one of the taps through the main substrate and the connection substrate.

14. A system, comprising:
a module substrate having a connecting region and a system region, the module substrate having a first surface and a second surface, the second surface being opposite the first surface;
a first substrate mounted on and electrically connected to the first surface of the module substrate in the connecting region, the first substrate having one or more first electrical connectors, the first substrate electrically connecting the first electrical connector to the module substrate;
at least one first system structure mounted on the first surface of the module substrate in the system region;
a second substrate mounted on and electrically connected to the second surface of the module substrate in the connecting region, the second substrate having one or more second electrical connectors, the second substrate electrically connecting the second electrical connector to the module substrate; and
at least one second system structure mounted on the second surface of the module substrate in the system region.

15. The system of claim 14 , wherein the first system structure is a chip.

16. The system of claim 14 , wherein the first system structure is a package.

17. The system of claim 14 , wherein the first system structure is a one of a chip and a package, and the second system structure is one of a chip and a package.

18. The system of claim 14 , wherein the system is a solid state drive.

19. The system of claim 14 , wherein an outer surface of the first substrate is at a different level than the first surface of the module substrate in the system region, and an outer surface of the second substrate is at another different level than the second surface of the module substrate in the system region.

Assignees

• Samsung Electronics Co Ltd
• Samsung Electronics Co Inc

Inventors

• Lee Yongkwan
• Yeom Kundae
• Lee Jongho
• Song Hogeon

Classifications

• H10W90/00 Primary

  Package configurations · CPC title

• H10W72/30

  Die-attach connectors · CPC title

• H10W70/614

  the multiple chips being integrally enclosed · CPC title

• H10W70/685

  comprising multiple insulating layers · CPC title

• H10W90/701 Primary

  characterised by the relative positions of pads or connectors relative to package parts · CPC title