Gold plate coated material

Patent metadata

Field	Value
Publication number	US-10006125-B2
Application number	US-201615163419-A
Country	US
Kind code	B2
Filing date	May 24, 2016
Priority date	Jul 13, 2012
Publication date	Jun 26, 2018
Grant date	Jun 26, 2018

Abstract

A method of electroless gold plating includes a step of forming an underlying alloy layer on a base material and a step of forming a gold plate layer directly on the underlying alloy layer by electroless reduction plating using a cyanide-free gold plating bath. The underlying alloy layer is formed of an M1-M2-M3 alloy, where M1 is at least one element selected from Ni, Fe, Co, Cu, Zn, where Sn, M2 is at least one element selected from Pd, Re, Pt, Rh, Ag and where Ru, and M3 is at least one element selected from P and B.

First claim

What is claimed is:

1. An electrical contact comprising:
a base material;
an underlying alloy layer formed on the base material; and
a gold plate layer, having a thickness of 5 to 200 nm, formed on the underlying alloy layer as an outermost surface layer which acts as an electrical contact point via its outermost surface,
wherein the underlying alloy layer is formed of an M1-M2-M3 alloy,
where M1 is at least one element selected from Ni, Fe, Co, Cu, Zn and Sn, M2 is at least one element selected from Pd, Re, Pt, Rh, Ag and Ru, and M3 is at least one element selected from P and B, and
wherein a ratio of each element in the M1-M2-M3 alloy is that M1 is 20 to 50 at %, M2 is 30 to 50 at %, and M3 is 20 to 30 at %.

2. The electrical contact as set forth in claim 1 , further comprising a modifying layer which is formed on the base material in order to enhance the interfacial adhesion property between the base material and the underlying alloy layer.

3. The electrical contact as set forth in claim 1 , wherein the thickness of the underlying alloy layer is 0.01 to 1.0 μm.

4. The electrical contact as set forth in claim 1 , wherein the M1-M2-M3 alloy is Ni—Pd—P ternary alloy, and
a ratio of each element in the Ni—Pd—P ternary alloy is that Ni is 20 to 50 at%, Pd is 30 to 50 at %, and P is 20 to 30 at %.

5. The electrical contact as set forth in claim 1 , wherein the M1-M2-M3 alloy consists of M1, M2 and M3,
where M1is one element selected from Ni, Fe, Co, Cu, Zn and Sn, M2 is one element selected from Pd, Re, Pt, Rh, Ag and Ru, and M3 is one element selected from P and B, and
wherein a ratio of each element in the M1-M2-M3 alloy is that M1 is 20 to 50 at %, M2is 30 to 42 at %, and M3 is 20 to 30 at %.

6. The electrical contact as set forth in claim 1 , further comprising a Ni—P plate layer which is formed between the base material and the underlying alloy layer.

Assignees

• Toyo Kohan Co Ltd

Inventors

• Mukai Nobuaki

Classifications

• Y10T428/24975

  No layer or component greater than 5 mils thick · CPC title

• Y10T428/24967

  Absolute thicknesses specified · CPC title

• Y10T428/2495

  Thickness [relative or absolute] · CPC title

• Y10T428/12972

  Containing 0.01-1.7% carbon [i.e., steel] · CPC title

• Y10T428/12944

  Ni-base component · CPC title