Controlled-porosity method for forming polishing pad

Patent metadata

Field	Value
Publication number	US-10005172-B2
Application number	US-201514751328-A
Country	US
Kind code	B2
Filing date	Jun 26, 2015
Priority date	Jun 26, 2015
Publication date	Jun 26, 2018
Grant date	Jun 26, 2018

Abstract

The invention is to a method of manufacturing a polishing pad suitable for planarizing at least one of semiconductor, optical and magnetic substrates. The method includes applying droplets of a liquid polymer against a substrate to form a plurality of pores. The liquid polymer contains a nonionic surfactant, the nonionic surfactant has a concentration sufficient to facilitate growth of pores within the liquid polymer and an ionic surfactant has a concentration sufficient to limit growth of the pores within the liquid polymer. Curing the solid polymer forms a polishing pad with final size of the plurality of pores controlled by the concentration of nonionic surfactant and ionic surfactants.

First claim

We claim:

1. A method of manufacturing a polishing pad suitable for planarizing at least one of semiconductor, optical and magnetic substrates, the method comprising the following:
a. applying droplets of a liquid polymer into a mold—to form a plurality of pores in the liquid polymer, the liquid polymer containing a nonionic surfactant, the nonionic surfactant having a concentration sufficient to facilitate growth of pores within the liquid polymer and a cationic surfactant having a concentration sufficient to limit growth of the pores within the liquid polymer;
b. solidifying the droplets of liquid polymer against the substrate into a solid polymer containing a plurality of pores:
c. repeating the applying of droplets and the solidifying of the droplets of liquid polymer multiple times to increase thickness of the porous solid polymer; and
d. reducing the amount of cationic surfactant to increase pore size and form a subpad; and
e. curing the solid polymer into the polishing pad with the subpad with a final size of the plurality of pores controlled by the concentration of nonionic surfactant and cationic surfactant.

2. The method of claim 1 wherein the droplets strike the mold to form a groove pattern in the polishing pad.

3. The method of claim 1 wherein the nonionic surfactant is a silicone surfactant.

4. The method of claim 1 wherein the curing forms the polishing pad with a density of 0.3 to 0.9 g/cm 3 .

5. A method of manufacturing a polishing pad suitable for planarizing at least one of semiconductor, optical and magnetic substrates, the method comprising the following:
a. applying droplets of a liquid polymer into a mold to form a plurality of pores in the liquid polymer, the liquid polymer containing a nonionic surfactant, the nonionic surfactant having a concentration sufficient to facilitate growth of pores within the liquid polymer and a cationic surfactant having a concentration sufficient to limit growth of the pores within the liquid polymer;
b. connecting adjacent pores to form a network of interconnected pores in the liquid polymer;
c. solidifying the droplets of liquid polymer against the substrate into a solid polymer containing a plurality of pores;
d. repeating the applying of droplets, connecting adjacent pores and the solidifying of the droplets of liquid polymer multiple times to increase thickness of the porous solid polymer;
e. reducing the amount of cationic surfactant to increase pore size and form a subpad; and
f. curing the solid polymer into a polishing pad with final size of the plurality of pores controlled by the concentration of nonionic surfactant and ionic surfactant.

6. The method of claim 5 wherein the droplets strike the mold to form a groove pattern in the polishing pad.

7. The method of claim 5 wherein the nonionic surfactant is a silicone surfactant.

8. The method of claim 5 wherein the curing forms the polishing pad with a density of 0.3 to 0.7 g/cm 3 .

Assignees

• Rohm & Haas Elect Materials Cmp Holdings Inc
• Dow Global Technologies Llc

Inventors

• Tong Yuhua
• Wank Andrew
• Lugo Diego
• Stack Marc R
• Veneziale David Michael
• Degroot Marty W
• Jacob George C
• Miller Jeffrey B

Classifications

• B24D18/009 Primary

  Tools not otherwise provided for · CPC title

• B24D11/001 Primary

  Manufacture of flexible abrasive materials · CPC title

• B29L2031/736

  Grinding or polishing equipment · CPC title

• B29C41/12

  Spreading-out the material on a substrate {, e.g. on the surface of a liquid} · CPC title

• B24B37/20

  Lapping pads for working plane surfaces · CPC title