Earth-boring tools having cutting elements with cutting faces exhibiting multiple coefficients of friction, and related methods

US9821437B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9821437-B2
Application numberUS-201514660716-A
CountryUS
Kind codeB2
Filing dateMar 17, 2015
Priority dateMay 1, 2012
Publication dateNov 21, 2017
Grant dateNov 21, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An earth-boring tool having at least one cutting element with a multi-friction cutting face provides for the steering of formation cuttings as the cuttings slide across the cutting face. The multi-friction cutting element includes a diamond table bonded to a substrate of superabrasive material. The diamond table has a cutting face formed thereon with a cutting edge extending along a periphery of the cutting face. The cutting face has a first area having an average surface finish roughness less than an average surface finish roughness of a second area of the cutting face, the two areas separated by a boundary having a proximal end proximate a tool crown and a distal end remote from the tool crown.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of forming an earth-boring tool, comprising: providing a plurality of cutting elements attached to a tool crown, a cutting face on at least one cutting element of the plurality of cutting elements comprising: a first area of the cutting face having a first average surface roughness; a second area of the cutting face having a second average surface roughness greater than the first average surface roughness; and a boundary between the first area and the second area extending across the cutting face; attaching the at least one cutting element of the plurality of cutting elements to the tool crown with a proximal end of the boundary adjacent a profile of the tool crown and a distal end of the boundary remote from the tool crown. 2. The method of claim 1 , further comprising polishing or depositing a diamond film on the first area of the cutting face to provide the first average surface roughness. 3. The method of claim 2 , further comprising: masking the second area of the cutting face; and depositing the diamond film on the first area of the cutting face by a chemical vapor deposition process. 4. The method of claim 1 , further comprising roughening the second area of the cutting face by at least one of laser etching, chemical etching, mechanical etching, and electrochemical etching. 5. The method of claim 4 , further comprising roughening the second area of the cutting face by laser etching a multiplicity of barcode-style etch paths onto the second area. 6. The method of claim 1 , further comprising forming the at least one cutting element by laterally bonding together a segment of a first cutting element having a cutting element with a cutting face of the first average surface roughness and a segment from a second cutting element with a cutting face of the second average surface roughness. 7. The method of claim 1 , further comprising polishing the first area of the cutting face using an ion beam process. 8. The method of claim 1 , wherein diamond grains within the first area of the cutting face have an average grain size different than an average grain size of diamond grains within the second area of the cutting face. 9. The method of claim 1 , further comprising locating and orienting the at least one cutting element on the tool crown such that the first area of the cutting face, the second area of the cutting face, and the boundary of the cutting face, in combination, are configured to steer a formation cutting severed by a portion of the cutting edge in contact with a formation in a direction laterally away from a center of the cutting face as the formation cutting contacts the cutting face. 10. The method of claim 1 , wherein the first area has a first substantially constant surface roughness and the second area has a second substantially constant surface roughness. 11. The method of claim 1 , wherein the first area of the cutting face has a surface roughness of about 0.1 to about 2 microinches and the second area of the cutting face has a surface roughness of about 10 to about 400 microinches. 12. The method of claim 1 , wherein the boundary between the first area and the second area is at least substantially linear. 13. The method of claim 12 , further comprising orienting the boundary at least substantially perpendicular to the tool crown at a location of attachment of the at least one cutting element to the tool crown. 14. The method of claim 12 , further comprising orienting the boundary at an angle between about zero degrees and about sixty degrees to the perpendicular at a location of attachment of the at least one cutting element to the tool crown. 15. The method of claim 1 , wherein the boundary is arcuate.

Assignees

Inventors

Classifications

  • having a cutting face with different segments, e.g. mosaic-type inserts · CPC title

  • cutting tools (sawing tools B23D63/00, B23D65/00; files or rasps B23D73/00) · CPC title

  • with chip breaking arrangements · CPC title

  • Increasing rugosity, i.e. roughening · CPC title

  • B24D18/009Primary

    Tools not otherwise provided for · CPC title

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What does patent US9821437B2 cover?
An earth-boring tool having at least one cutting element with a multi-friction cutting face provides for the steering of formation cuttings as the cuttings slide across the cutting face. The multi-friction cutting element includes a diamond table bonded to a substrate of superabrasive material. The diamond table has a cutting face formed thereon with a cutting edge extending along a periphery o…
Who is the assignee on this patent?
Baker Hughes Inc
What technology area does this patent fall under?
Primary CPC classification B24D18/009. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Nov 21 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).