Multi-layer capacitor package and package housing

Patent metadata

Field	Value
Publication number	US-10002712-B2
Application number	US-201615063753-A
Country	US
Kind code	B2
Filing date	Mar 8, 2016
Priority date	Mar 9, 2015
Publication date	Jun 19, 2018
Grant date	Jun 19, 2018

Abstract

Disclosed is a multi-layer capacitor package comprising: a multi-layer capacitor; connection electrodes coupled to capacitor electrodes respectively, wherein the connection electrodes in each group of the connection electrodes vertically overlap with each other, and first and second groups of the connection electrodes are horizontally spaced from each other; a package housing configured to receive therein the multi-layer capacitor; and first and second internal electrodes received in the housing to be coupled to the first and second groups of the connection electrodes respectively, wherein the first and second internal electrodes are horizontally spaced from each other.

First claim

What is claimed is:

1. A multi-layer capacitor package comprising:
a multi-layer capacitor comprising at least two vertical alterations of capacitor electrodes and dielectric layers on a base substrate, the capacitor electrodes having substantially the same area;
connection electrodes coupled to the capacitor electrodes respectively and extending from the capacitor electrodes respectively, wherein the connection electrodes are divided into at least two groups of the connection electrodes including first and second groups, wherein the connection electrodes in each group vertically overlap with each other, and the first and second groups are horizontally spaced from each other;
a package housing configured to receive therein the multi-layer capacitor, wherein the package housing comprises a bottom portion and side portions coupled to the bottom portion; and
first and second internal electrodes received in the package housing to be coupled to the first and second groups of the connection electrodes respectively, wherein the first and second internal electrodes are horizontally spaced from each other.

2. The package of claim 1 , further comprising:
a first through-electrode passing through the first group of the connection electrodes, the first through-electrode having a bottom portion contacting the first internal electrode; and
a second through-electrode passing through the second group of the connection electrodes, the second through-electrode having a bottom portion contacting the second internal electrode.

3. The package of claim 2 , wherein the connection electrodes in the first group of connection electrodes are insulated from each other via an insulating layer therebetween, and the connection electrodes in the second group of connection electrodes are insulated from each other via the insulating layer therebetween.

4. The package of claim 1 , wherein each of the first internal electrode and the second internal electrode extends on and along the bottom portion of the package housing.

5. The package of claim 1 , wherein each of the connection electrodes has an exposed outer side face, wherein the exposed outer side faces of the connection electrodes face the same inner side face of the package housing.

6. The package of claim 5 , wherein the first internal electrode includes:
a first electrode portion contacting the exposed side face of the connection electrodes of the first group and extending on and along the side portion of the package housing; and
a second electrode portion coupled to the first electrode portion, and extending on and along the bottom portion of the package housing, and
wherein the second internal electrode includes:
a third electrode portion contacting the exposed side face of the connection electrodes of the second group and extending on and along the side portion of the package housing; and
a fourth electrode portion coupled to the third electrode portion, and extending on and along the bottom portion of the package housing.

7. The package of claim 1 , further comprising:
a first external terminal coupled to the first internal electrode and passing through the bottom portion of the package housing outside of the housing; and
a second external terminal coupled to the second internal electrode and passing through the bottom portion of the package housing outside of the housing.

8. The package of claim 1 , wherein each of the dielectric layers has an upper surface portion having pores formed therein, and each connection electrode is horizontally coupled to a corresponding capacitor electrode and to a dielectric layer immediately on the corresponding capacitor electrode.

9. A package housing for a multi-layer capacitor, the housing comprising:
a bottom portion;
side portions coupled to the bottom portion to define an inner space together with the bottom portion;
a first internal electrode formed in the inner space to contact the multi-layer capacitor; and
a second internal electrode formed in the inner space to contact the multi-layer capacitor, wherein the first internal electrode is spaced from the second internal electrode, wherein each of the first internal electrode and second internal electrode comprises:
a first electrode portion extending on and along the bottom portion; and
a second electrode portion coupled to the first electrode portion, the second electrode portion extending on and along the side portion.

Assignees

• Research & Business Found Sungkyunkwan Univ

Inventors

• Seo Su-Jeong
• Kim Tae-Yoo
• Park Jung-Kab
• Song Young-Il
• Shin Jin-Ha
• Lee Jungwoo
• Cho Younglae
• Ahn Byung-Wook
• Park Jung-Ho
• Yun Sook-Young
• Baeg Seung-Bin
• NA Young-il

Classifications

• H01G4/012

  Form of non-self-supporting electrodes · CPC title

• H01G4/232

  electrically connecting two or more layers of a stacked or rolled capacitor · CPC title

• H01G4/30 Primary

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01G4/224

  Housing; Encapsulation · CPC title