Method for fabricating a pressure sensor

Patent metadata

Field	Value
Publication number	US-10001421-B2
Application number	US-201415030301-A
Country	US
Kind code	B2
Filing date	Oct 24, 2014
Priority date	Oct 25, 2013
Publication date	Jun 19, 2018
Grant date	Jun 19, 2018

Abstract

A method of fabricating a pressure sensor is disclosed. Initially, a first metal is deposited on top of a substrate, and the first metal is patterned accordingly. A PVDF-TrFE nano fiber is then deposited on top of the first metal layer, and the PVDF-TrFE nano fiber is etched. A second metal layer is subsequently deposited on top of the PVDF-TrFE nano fiber, and the second metal layer is etched to form a pressure sensor.

First claim

What is claimed is:

1. A pressure sensor comprising:
a substrate;
a PVDF fiber having a core and a core shell;
a first electrode located between said PVDF fiber and said substrate;
a second electrode located opposite said first electrode with said PVDF fiber located between said first and second electrodes;
a first terminal connected to said first and second electrodes; and
a second terminal connected to said core within said PVDF fiber, wherein a number of charges induced within said PVDF fiber caused by any pressure applied to said PVDF fiber is configured to be measured via said first and second terminals.

2. The pressure sensor of claim 1 , wherein said number of charges induced within said PVDF fiber is linearly proportional to the amount of pressure being applied to said PVDF fiber.

3. The pressure sensor of claim 1 , wherein said substrate is a double silicon-on-insulator substrate.

4. The pressure sensor of claim 1 , wherein said substrate is a kapton substrate.

5. A method of fabricating a sensor, said method comprising:
depositing and patterning a first metal layer on top of a substrate;
depositing a PVDF nano fiber on top of said substrate, making contact with said first metal layer, wherein said PVDF nano fiber includes a core and a core shell;
etching said PVDF nano fiber;
depositing a second metal layer on top of said PVDF nano fiber;
etching said second metal layer;
forming a first terminal of said sensor by connecting said first and second metal layers; and
forming a second terminal of said sensor by utilizing said a core of said PVDF nano fiber.

6. The method of claim 5 , wherein said substrate is a double silicon-on-insulator substrate.

7. The method of claim 5 , wherein said substrate is includes a kapton substrate.

8. The method of claim 5 , wherein said PVDF nano fiber is etched via a reactive ion etch.

9. The method of claim 5 , wherein said second metal layer is etched via a reactive ion etch.

10. A method of fabricating a sensor, said method comprising:
depositing and patterning a first metal layer on top of a substrate;
depositing a PVDF-TrFE nano fiber on top of said substrate, making contact with said first metal layer, wherein said PVDF-TrFE nano fiber includes a core and a core shell;
etching said PVDF-TrFE nano fiber;
depositing a second metal layer on top of said PVDF-TrFE nano fiber;
etching said second metal layer;
forming a first terminal of said sensor by connecting said first and second metal layers; and
forming a second terminal of said sensor by utilizing said core of said PVDF-TrFE nano fiber.

11. The method of claim 10 , wherein said substrate is a double silicon-on-insulator substrate.

12. The method of claim 10 , wherein said substrate is a kapton substrate.

13. The method of claim 10 , wherein said PVDF-TrFE nano fiber is etched via a reactive ion etch.

14. The method of claim 10 , wherein said second metal layer is etched via a reactive ion etch.

Assignees

• Univ Texas
• Sharma Tushar
• Zhang Xiaojing

Inventors

• Sharma Tushar
• Zhang Xiaojing

Classifications

• H01L41/087

  Electricity · mapped topic

• G01L9/008 Primary

  using piezoelectric devices (piezoelectric resonators G01L9/0022; surface acoustic waves G01L9/0025) · CPC title

• G01L1/16 Primary

  using properties of piezoelectric devices · CPC title

• H01L41/1132

  Electricity · mapped topic

• G01L9/08

  by making use of piezoelectric devices {, i.e. electric circuits therefor} · CPC title