Solid-state structures with volatile sintering aids, and methods for fabrication and use thereof
US-2024429439-A1 · Dec 26, 2024 · US
US10000842B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10000842-B2 |
| Application number | US-201515319578-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 24, 2015 |
| Priority date | Jun 26, 2014 |
| Publication date | Jun 19, 2018 |
| Grant date | Jun 19, 2018 |
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Provided is an oxide sintered body that, when used to obtain an oxide semiconductor thin film by sputtering, can achieve a low carrier concentration and a high carrier mobility. Also provided is a sputtering target using the oxide sintered body. The oxide sintered body contains, as oxides, indium, gallium, and at least one positive divalent element selected from the group consisting of nickel, cobalt, calcium, strontium, and lead. The gallium content, in terms of the atomic ratio Ga/(In+Ga), is from 0.20 to 0.45, and the positive divalent element content, in terms of the atomic ratio M/(In+Ga+M), is from 0.0001 to 0.05. The amorphous oxide semiconductor thin film, which is formed using the oxide sintered body as a sputtering target, can achieve a carrier concentration of less than 3.0×10 18 cm −3 and a carrier mobility of at least 10 cm 2 V −1 sec −1 .
Opening claim text (preview).
The invention claimed is: 1. An oxide sintered body comprising indium, gallium, and a positive divalent element as oxides, wherein a gallium content is 0.20 or more and 0.45 or less in terms of Ga/(In+Ga) atomic ratio, the total content of all positive divalent elements is 0.0001 or more and 0.05 or less in terms of M/(In+Ga+M) atomic ratio, the positive divalent element is one or more selected from the group consisting of nickel, cobalt, calcium, strontium, and lead, the oxide sintered body includes; an In 2 O 3 phase having a bixbyite-type structure; and a GaInO 3 phase having a β-Ga 2 O 3 -type structure as a formed phase other than the In 2 O 3 phase, or a GaInO 3 phase having a β-Ga 2 O 3 -type structure and a (Ga, In) 2 O 3 phase as a formed phase other than the In 2 O 3 phase; and the oxide sintered body is free of a NiGa 2 O 4 phase, a CoGa 2 O 4 phase, a CaGa 4 O 7 phase, a Ca 5 Ga 6 O 14 phase, a SrGa 12 O 19 phase, a SrGa 2 O 4 phase, a Sr 3 Ga 2 O 6 phase, and a Ga 2 PbO 4 phase, which are a complex oxide composed of the positive divalent element and gallium or a complex oxide phase of these. 2. The oxide sintered body according to claim 1 , wherein the total content of all the positive divalent elements is 0.0001 or more and 0.03 or less in terms of M/(In +Ga+M) atomic ratio. 3. The oxide sintered body according to claim 1 , wherein the gallium content is 0.20 or more and 0.30 or less in terms of Ga/(In+Ga) atomic ratio. 4. The oxide sintered body according to claim 1 , wherein a content of element M′ being positive divalent elements other than the positive divalent element and positive trivalent to positive hexavalent elements other than indium and gallium is 500 ppm or less in terms of M′/(In+Ga+M′) atomic ratio. 5. The oxide sintered body according to claim 1 , wherein an X-ray diffraction peak intensity ratio of a GaInO 3 phase having a β-Ga 2 O 3 -type structure defined by formula 1 below is in a range of 29% or more and 75% or less, 100×I[GaInO 3 phase (111)]/{I[In 2 O 3 phase (400)]+I[GaInO 3 phase (111)]}[%] (Formula I), wherein in Formula 1, I[In 2 O 3 phase (400)] represents a (400) peak intensity of the In 2 O 3 phase having a bixbyite-type structure, and I[GalnO 3 phase (111)] represents a (111) peak intensity of the β-GaInO 3 phase that is a composite oxide having a β-Ga 2 O 3 -type structure.
Chemical treatments · CPC title
Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title
Dry etching; Plasma etching; Reactive-ion etching · CPC title
Amorphous · CPC title
being oxide semiconductor materials (Group IIB-VIA semiconductor materials H10P14/3424) · CPC title
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