Structures and process for preventing a projection of the laser resealing structure beyond the wafer surface

Patent metadata

Field	Value
Publication number	US-10000375-B2
Application number	US-201615299600-A
Country	US
Kind code	B2
Filing date	Oct 21, 2016
Priority date	Oct 26, 2015
Publication date	Jun 19, 2018
Grant date	Jun 19, 2018

Abstract

A method for manufacturing a micromechanical component including a substrate and a cap connected to the substrate and together with the substrate enclosing a first cavity, a first pressure prevailing and a first gas mixture with a first chemical composition being enclosed in the first cavity. An access opening, connecting the first cavity to surroundings of the micromechanical component, is formed in the substrate or the cap. The first pressure and/or the first chemical composition is adjusted in the first cavity. The access opening is sealed by introducing energy and heat into an absorbing part of the substrate or cap with the aid of a laser. A recess is formed in a surface of the substrate or of the cap facing away from the first cavity in the area of the access opening for accommodating a material area of the substrate or the cap converted into a liquid aggregate state.

First claim

What is claimed is:

1. A method for manufacturing a micromechanical component including a substrate and a cap connected to the substrate and together with the substrate enclosing a first cavity, a first pressure prevailing and a first gas mixture with a first chemical composition being enclosed in the first cavity, the method comprising:
in a first step, forming an access opening, connecting the first cavity to surroundings of the micromechanical component, in the substrate or in the cap;
in a second step, adjusting at least one of the first pressure and the first chemical composition in the first cavity;
in a third step, sealing the access opening with a material of the substrate or the cap by introducing energy and heat into an absorbing area of the substrate or the cap with the aid of a laser, wherein the introduction of the heat and energy melts a portion of the substrate or cap into a liquid aggregate state; and
in a fourth step, forming a recess in a first surface of the substrate or of the cap facing away from the first cavity in the area of the access opening for accommodating the melted portion of the substrate or the cap.

2. The method as recited in claim 1 , wherein the melted portion of substrate or cap solidifies to form a solidified material area after the third step, and wherein the recess is formed in such a way that the solidified material area is situated between a plane extending along the first surface of the substrate or cap and a plane extending along a second surface of the substrate or cap, the second surface facing the cavity.

3. The method as recited in claim 1 , wherein the melted portion of the substrate or cap solidifies to form a solidified material area after the third step, and wherein the recess is formed in such a way that a first surface of a projection of the recess onto a plane extending along the first surface of the substrate or cap is larger than a second surface of a projection of the solidified material area or of the absorbing part of the substrate or of the cap onto the plane.

4. The method as recited in claim 1 , wherein the melted portion of the substrate or cap solidifies to form a solidified material area after the third step, and wherein the recess is formed in such a way that a first surface of a projection of the recess onto a plane extending along the first surface of the substrate or cap is smaller than a second surface of a projection of the solidified material area or of the absorbing part of the substrate or of the cap onto the plane.

5. The method as recited in claim 1 , wherein the recess is formed in a plane extending in parallel to the first surface of the substrate or cap, rotationally symmetrical to the access channel or to the melted portion or to the absorbing part of the substrate or of the cap.

6. The method as recited in claim 1 , wherein the recess is anisotropically etched into the first surface of the substrate or cap.

Assignees

• Bosch Gmbh Robert

Inventors

• Reichenbach Frank
• Reinmuth Jochen
• Frey Jens
• Amthor Julia

Classifications

• B81B2201/0242

  Gyroscopes · CPC title

• B81C1/00325

  for reducing stress inside of the package structure · CPC title

• B81C2201/013

  Etching · CPC title

• B81B2201/0235

  Accelerometers · CPC title

• B81C1/00293

  maintaining a controlled atmosphere with processes not provided for in B81C1/00285 · CPC title