Logic-uppermost semiconductor device assemblies with reconstituted wafers and multi-reticle dies coupled by reticle-bridging conductors
US-2026041008-A1 · Feb 5, 2026 · US
Zaleski Mark is listed as an inventor on 9 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Zaleski Mark |
| Total patents | 9 |
| First publication | Aug 9, 2018 |
| Latest publication | Feb 5, 2026 |
Publications ranked by popularity score, then publication date.
US-2026041008-A1 · Feb 5, 2026 · US
US-2026032915-A1 · Jan 29, 2026 · US
US-2024147693-A1 · May 2, 2024 · US
US-11903183-B2 · Feb 13, 2024 · US
US-11696432-B2 · Jul 4, 2023 · US
US-2022108987-A1 · Apr 7, 2022 · US
US-2022108988-A1 · Apr 7, 2022 · US
US-10181420-B2 · Jan 15, 2019 · US
US-2018226294-A1 · Aug 9, 2018 · US
Latest publications not already listed above.
No data yet.
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Micron Technology Inc | 7 |
| Globalfoundries Inc | 2 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10D88/00 | 5 |
| H10B12/30 | 5 |
| G11C5/025 | 5 |
| G11C5/10 | 5 |
| H01L27/0688 | 5 |