Doped silicon or boron layer formation
US-2026090294-A1 · Mar 26, 2026 · US
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Yang Nuoya patents
Yang Nuoya is listed as an inventor on 8 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Yang Nuoya |
| Total patents | 8 |
| First publication | Jun 30, 2022 |
| Latest publication | Mar 26, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Independently adjustable flowpath conductance in multi-station semiconductor processing
US-2026043135-A1 · Feb 12, 2026 · US
Deposition and etch of silicon-containing layer
US-2025372367-A1 · Dec 4, 2025 · US
Trim and deposition profile control with multi-zone heated substrate support for multi-patterning processes
US-2024392443-A1 · Nov 28, 2024 · US
In-situ core protection in multi-patterning
US-2024355624-A1 · Oct 24, 2024 · US
Trim and deposition profile control with multi-zone heated substrate support for multi-patterning processes
US-12071689-B2 · Aug 27, 2024 · US
Independently adjustable flowpath conductance in multi-station semiconductor processing
US-2022228263-A1 · Jul 21, 2022 · US
Trim and deposition profile control with multi-zone heated substrate support for multi-patterning processes
US-2022205105-A1 · Jun 30, 2022 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Lam Res Corp | 8 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C23C16/52 | 7 |
| H10P72/0402 | 5 |
| C23C16/45544 | 5 |
| H10P72/0432 | 4 |
| H10P76/4085 | 4 |