Printed circuit board with embedded bump pads
US-2023345633-A1 · Oct 26, 2023 · US
This page is not indexed by search engines while we improve data quality.
Yang Jack patents
Yang Jack is listed as an inventor on 1 patent in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Yang Jack |
| Total patents | 1 |
| First publication | Oct 26, 2023 |
| Latest publication | Oct 26, 2023 |
Notable patents
Publications ranked by popularity score, then publication date.
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Western Digital Tech Inc | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H05K1/111 | 1 |
| H05K3/4007 | 1 |
| H05K3/24 | 1 |
| H05K2201/10378 | 1 |
| H05K2201/10734 | 1 |