Hybrid bonding structure and hybrid bonding method
US-11756922-B2 · Sep 12, 2023 · US
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Xie Ronghua patents
Xie Ronghua is listed as an inventor on 6 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Xie Ronghua |
| Total patents | 6 |
| First publication | Jun 23, 2016 |
| Latest publication | Sep 12, 2023 |
Notable patents
Publications ranked by popularity score, then publication date.
Heat conductor, heat-conducting material, and package structure of semiconductor device
US-2022216124-A1 · Jul 7, 2022 · US
Hybrid bonding structure and hybrid bonding method
US-2022077105-A1 · Mar 10, 2022 · US
Method for base station backhaul, related device and system for base station backhaul
US-10164731-B2 · Dec 25, 2018 · US
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US-9397632-B2 · Jul 19, 2016 · US
Method for base station backhaul, related device and system for base station backhaul
US-2016182180-A1 · Jun 23, 2016 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Huawei Tech Co Ltd | 6 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H04L5/0007 | 2 |
| H04B10/548 | 2 |
| H04J14/0298 | 2 |
| H04L5/0044 | 2 |
| H04B10/25753 | 2 |