Semiconductor package assembly with through silicon via interconnect
US-9947624-B2 · Apr 17, 2018 · US
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Wu kai-bin patents
Wu kai-bin is listed as an inventor on 4 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Wu kai-bin |
| Total patents | 4 |
| First publication | Jun 23, 2016 |
| Latest publication | Apr 17, 2018 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor package assembly with through silicon via interconnect
US-2017110406-A1 · Apr 20, 2017 · US
Semiconductor package assembly with through silicon via interconnect
US-9570399-B2 · Feb 14, 2017 · US
Semiconductor package assembly with through silicon via interconnect
US-2016181201-A1 · Jun 23, 2016 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Mediatek Inc | 4 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W20/212 | 4 |
| H10W90/722 | 4 |
| H10W90/297 | 4 |
| H10W90/701 | 4 |
| H10W90/00 | 4 |