High registration particles-transferring system
US-12297538-B2 · May 13, 2025 · US
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Wang Yunda patents
Wang Yunda is listed as an inventor on 30 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Wang Yunda |
| Total patents | 30 |
| First publication | Jun 22, 2017 |
| Latest publication | May 13, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
System and method for repairing vacancies resulting from mass transfer of devices
US-2024339560-A1 · Oct 10, 2024 · US
System and method for repairing vacancies resulting from mass transfer of devices
US-12068430-B2 · Aug 20, 2024 · US
High registration particles-transferring system
US-2023366093-A1 · Nov 16, 2023 · US
Thermal insulation and temperature control of components
US-11785705-B2 · Oct 10, 2023 · US
Electrocaloric system
US-2023280073-A1 · Sep 7, 2023 · US
High registration particles-transferring system
US-11732362-B2 · Aug 22, 2023 · US
System and method for repairing vacancies resulting from mass transfer of devices
US-2022336696-A1 · Oct 20, 2022 · US
Method and system for assembly of micro-LEDs onto a substrate
US-11348905-B2 · May 31, 2022 · US
Transfer elements that selectably hold and release objects based on changes in stiffness
US-11302561-B2 · Apr 12, 2022 · US
Recent patents
Latest publications not already listed above.
Method and system for assembly of micro-leds onto a substrate
US-2021272935-A1 · Sep 2, 2021 · US
Transfer Elements that Selectably Hold and Release Objects Based on Changes in Stiffness
US-2021143045-A1 · May 13, 2021 · US
Transfer substrate utilizing selectable surface adhesion transfer elements
US-10964582-B2 · Mar 30, 2021 · US
Thermal insulation and temperature control of components
US-2021076484-A1 · Mar 11, 2021 · US
Thermal insulation and temperature control of components
US-10917963-B2 · Feb 9, 2021 · US
Transfer substrate utilizing selectable surface adhesion transfer elements
US-2020402831-A1 · Dec 24, 2020 · US
High registration particles-transferring system
US-2020173026-A1 · Jun 4, 2020 · US
High registration particles-transferring system
US-10604843-B2 · Mar 31, 2020 · US
Thermal insulation and temperature control of components
US-2020008294-A1 · Jan 2, 2020 · US
Thermal insulation and temperature control of components
US-10470292-B2 · Nov 5, 2019 · US
Multilayer capacitor
US-10460878-B2 · Oct 29, 2019 · US
Multilayer capacitor
US-10403439-B2 · Sep 3, 2019 · US
Multilayer capacitor
US-2019122825-A1 · Apr 25, 2019 · US
Thermal insulation and temperature control of components
US-2019069390-A1 · Feb 28, 2019 · US
High registration particles-transferring system
US-2018327905-A1 · Nov 15, 2018 · US
Electrocaloric system
US-2018164001-A1 · Jun 14, 2018 · US
Mechanical heat switch and method
US-2018114659-A1 · Apr 26, 2018 · US
Printed level sensor
US-9952082-B2 · Apr 24, 2018 · US
Printed level sensor
US-2017328761-A1 · Nov 16, 2017 · US
Multilayer capacitor
US-2017178819-A1 · Jun 22, 2017 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Palo Alto Res Ct Inc | 26 |
| Xerox Corp | 9 |
| Basf Se | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P72/7428 | 9 |
| H10W90/00 | 9 |
| H10P72/74 | 9 |
| H01L25/0753 | 9 |
| H10W72/0198 | 8 |