Thin semiconductor package for notched semiconductor die
US-11942369-B2 · Mar 26, 2024 · US
This page is not indexed by search engines while we improve data quality.
Wang Sw Wei patents
Wang Sw Wei is listed as an inventor on 4 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Wang Sw Wei |
| Total patents | 4 |
| First publication | Aug 15, 2019 |
| Latest publication | Mar 26, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Thin semiconductor package and related methods
US-2020357697-A1 · Nov 12, 2020 · US
Thin semiconductor package and related methods
US-10763173-B2 · Sep 1, 2020 · US
Thin semiconductor package and related methods
US-2019252255-A1 · Aug 15, 2019 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Semiconductor Components Ind Llc | 4 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W72/0198 | 4 |
| H10W72/944 | 4 |
| H10W72/952 | 4 |
| H10W72/9413 | 4 |
| H10P50/00 | 4 |